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AN121516
BGT24ATR22 DPA shield
XENSIV™ 24 GHz radar system platform
Board version V2.0
About this document
Scope and purpose
This application note describes the function, circuitry, and performance of the XENSIV™ BGT24ATR22 24 GHz
radar dual patch antenna (DPA) shield. The shield is the demo platform that accompanies Infineon's XENSIV™
BGT24ATR22 24 GHz radar sensor with an external two pairs of patch antennas. The shield offers a digital
interface for configuration and transfer of the acquired radar data to a microcontroller board such as Radar
Baseboard MCU7.
Intended audience
This document is intended for design engineers, technicians, and developers of electronic systems, working
with Infineon's XENSIV™ BGT24ATR22 24 GHz low-power radar sensor.
Application note
Please read the sections "Important notice" and "Warnings" at the end of this document
Revision 1.00
www.infineon.com
2024-06-13
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Summary of Contents for Infineon XENSIV BGT24ATR22 DPA shield
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Page 1: About This Document
This application note describes the function, circuitry, and performance of the XENSIV™ BGT24ATR22 24 GHz radar dual patch antenna (DPA) shield. The shield is the demo platform that accompanies Infineon’s XENSIV™ BGT24ATR22 24 GHz radar sensor with an external two pairs of patch antennas. The shield offers a digital interface for configuration and transfer of the acquired radar data to a microcontroller board such as Radar Baseboard MCU7. -
Page 2: Table Of Contents
BGT24ATR22 DPA shield XENSIV™ 24 GHz radar system platform Table of contents Table of contents About this document ........................1 Table of contents ..........................2 Introduction .......................... 3 24 GHz radar system platform ........................ 3 Key features ............................. 3 Hardware specifications ......................5 Overview .............................. -
Page 3: Introduction
The 24 GHz radar system platform described in this application note demonstrates the operational parameters of Infineon’s BGT24ATR22 24 GHz radar MMIC. The platform consists of two boards: the RF shield containing the MMIC and antennas, and Radar Baseboard MCU7. - Page 4 BGT24ATR22 DPA shield XENSIV™ 24 GHz radar system platform 1 Introduction Integrated analog baseband amplifiers • Automatic DC offset compensation • Integrated 12-bit ADC • Fully ESD-protected device • VQFN32-9 plastic package • Figure 2 Block diagram of BGT24ATR22 Application note Revision 1.00 2024-06-13...
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Page 5: Hardware Specifications
BGT24ATR22 DPA shield XENSIV™ 24 GHz radar system platform 2 Hardware specifications Hardware specifications Overview Top view Bottom view 48 mm Figure 3 BGT24ATR22 shield v2.0 (top and bottom views) The BGT24ATR22 DPA shield v2.0 has dimensions of 48 mm x 42 mm on a 4-layer board (see Section details of the layer stack). -
Page 6: Schematics
BGT24ATR22 DPA shield XENSIV™ 24 GHz radar system platform 2 Hardware specifications Schematics Figure 4 Overview of the schematic of the shield Sensor supply BGT24ATR22 supports 1.8 – 3.3 V as VDD and GPIO voltages, dependent on whether 1.8 V or 3.3 V are supplied. A chip-internal LDO generates 1.5 V as VDD_D as the digital supply. - Page 7 BGT24ATR22 DPA shield XENSIV™ 24 GHz radar system platform 2 Hardware specifications Figure 5 External LDO generating 1.8 V output as VDD (VDD_RF, VDD_VCO, VDD_A) from 3.3 V input BGT24ATR22 is intended to be used in a heavy pulsed operational mode, showing high load transients for the supply current.
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Page 8: Oscillator
BGT24ATR22 DPA shield XENSIV™ 24 GHz radar system platform 2 Hardware specifications Oscillator The 38.4 MHz crystal serves as a high-precision time reference to calibrate the transmitted VCO frequency. The internal oscillator is based on a Pierce oscillator architecture, which usually requires symmetrical load capacitors. -
Page 9: Eeprom And I2C Pull-Ups
BGT24ATR22 DPA shield XENSIV™ 24 GHz radar system platform 2 Hardware specifications Figure 9 Pin headers for debugging EEPROM and I2C pull-ups Optionally, the BGT24ATR22 RF shield contains an EEPROM memory to store data such as the board identifier, with connections as shown in Figure 10. -
Page 10: External Filter Capacitors
BGT24ATR22 DPA shield XENSIV™ 24 GHz radar system platform 2 Hardware specifications Figure 12 Resistors connecting 1.8 V domain External filter capacitors C3 and C7 shown in Figure 13 are filter capacitors. C3 reduces the noise generated by the internal 1.5 V LDO, while C7 stores the voltage generated by the DAC which controls the tuning voltage. -
Page 11: Metal Layers
BGT24ATR22 DPA shield XENSIV™ 24 GHz radar system platform 2 Hardware specifications Surface finish is Electroless Nickel Immersion Gold (ENIG). Note: The RF shield design uses only through-hole vias. No blind vias are required. 2.10 Metal layers Figure 15 Top layer – Antennas and MMIC Figure 16 Layer 2 –... - Page 12 BGT24ATR22 DPA shield XENSIV™ 24 GHz radar system platform 2 Hardware specifications Figure 17 Layer 3 – Signal routing Figure 18 Bottom layer – Signal routing and supporting components Application note Revision 1.00 2024-06-13...
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Page 13: Layout Overview
BGT24ATR22 DPA shield XENSIV™ 24 GHz radar system platform 3 Layout overview Layout overview Top side with MMIC and antennas Tilted patch antennas Matching structures Additional ESD protection λ/4 stub Pin 1 marking Figure 19 Layout elements on top side The top side features all the RF-related structures and the MMIC. -
Page 14: Mmic Footprint
BGT24ATR22 DPA shield XENSIV™ 24 GHz radar system platform 3 Layout overview 3.1.1 MMIC footprint It is recommended to use the exact footprint as shown in Figure 20 because this structure was optimized for use with BGT24ATR22 and recommended PCB material. Figure 20 Recommended PCB footprint Application note... -
Page 15: Patch Antennas
BGT24ATR22 DPA shield XENSIV™ 24 GHz radar system platform 3 Layout overview 3.1.2 Patch antennas The antenna pattern of the patch antennas is designed in a way that the RF shield can be mounted in a position tilted approximately 45° towards the ground, in order to achieve easy mounting such as behind the bumper of a car. - Page 16 BGT24ATR22 DPA shield XENSIV™ 24 GHz radar system platform 3 Layout overview Figure 23 Simulated radiation pattern of patch antennas, intended vertical plane when mounted behind the bumper, at +30 degree main-lobe angle Figure 24 Simulated radiation pattern of patch antennas, intended vertical plane when mounted behind the bumper, at -30 degree main-lobe angle Figure 25 Simulated radiation pattern of patch antennas, Tx1/Rx1, 3D view...
- Page 17 BGT24ATR22 DPA shield XENSIV™ 24 GHz radar system platform 3 Layout overview Figure 26 Simulated radiation pattern of patch antennas, Tx2/Rx2, 3D view Figure 27 Simulated radiation pattern of patch antennas, Tx1/Rx1, side-view Application note Revision 1.00 2024-06-13...
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Page 18: Bottom Side With Supporting Components
BGT24ATR22 DPA shield XENSIV™ 24 GHz radar system platform 3 Layout overview Figure 28 Simulated radiation pattern of patch antennas, Tx2/Rx2, side-view Bottom side with supporting components Debug header Crystal Debug header Testpoints Connectors to RBB MCU7 Figure 29 Components on bottom side All external components except the MMIC are placed on the bottom side of the RF shield. - Page 19 BGT24ATR22 DPA shield XENSIV™ 24 GHz radar system platform 3 Layout overview There is a risk of the Hirose connectors wearing out when regularly plugged into and unplugged from the shield. To prevent this, it is recommended not to lift the board out of the connector on the short side. Instead, simply pull on the long side of the board, thereby tilting the short side.
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Page 20: References
BGT24ATR22 DPA shield XENSIV™ 24 GHz radar system platform References References [1] Infineon Technologies AG: AN599: Radar Baseboard MCU7; Available online Application note Revision 1.00 2024-06-13... -
Page 21: Revision History
BGT24ATR22 DPA shield XENSIV™ 24 GHz radar system platform Revision history Revision history Document Date Description of changes revision 1.00 2024-06-13 Initial version Application note Revision 1.00 2024-06-13... -
Page 22: Disclaimer
Infineon Technologies hereby Infineon Technologies’ products may not be used in disclaims any and all warranties and liabilities of any applications where a failure of the product or any any kind (including without limitation warranties of © 2024 Infineon Technologies AG.
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