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Dear customer
ROHM Co., Ltd. ("ROHM"), on the 1st day of April, 2024,
has absorbed into merger with 100%-owned subsidiary of LAPIS Technology Co., Ltd.
Therefore, all references to "LAPIS Technology Co., Ltd.", "LAPIS Technology"
and/or "LAPIS" in this document shall be replaced with "ROHM Co., Ltd."
Furthermore, there are no changes to the documents relating to our products other than
the company name, the company trademark, logo, etc.
Thank you for your understanding.
ROHM Co., Ltd.
April 1, 2024
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Table of Contents
Related Manuals for Rohm LAPIS ML7456N LSI
Summary of Contents for Rohm LAPIS ML7456N LSI
- Page 1 100%-owned subsidiary of LAPIS Technology Co., Ltd. Therefore, all references to "LAPIS Technology Co., Ltd.", "LAPIS Technology" and/or "LAPIS" in this document shall be replaced with "ROHM Co., Ltd." Furthermore, there are no changes to the documents relating to our products other than the company name, the company trademark, logo, etc.
- Page 2 FEXL7456NDG-01 ML7456N LSI Hardware Design Manual...
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Page 3: Notes
ML7456N LSI Hardware Design Manual NOTES 1) The information contained herein is subject to change without notice. 2) When using LAPIS Technology Products, refer to the latest product information (data sheets, user’s manuals, application notes, etc.), and ensure that usage conditions (absolute maximum ratings, recommended operating conditions, etc.) are within the ranges specified. - Page 4 ML7456N LSI Hardware Design Manual Export Administration Regulations and the Foreign Exchange and Foreign Trade Act.. 10) Please contact a ROHM sales office if you have any questions regarding the information contained in this document or LAPIS Technology's Products. 11) This document, in part or in whole, may not be reprinted or reproduced without prior consent of LAPIS Technology.
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Page 5: Introduction
ML7456N LSI Hardware Design Manual Introduction This hardware design manual contains hardware information that should be referenced when designing ML7456N devices. Target product ML7456N The following related manual is available and should be referenced as needed ML7456N data sheet ... -
Page 6: Notation
ML7456N LSI Hardware Design Manual Notation Classification Notation Description Numeric value 0xnn Represents a hexadecimal number. 0bnnnn Represents a binary number. Address 0xnnnn_nnnn Represents a hexadecimal number. (indicates 0xnnnnnnnn) Unit word, W 1 word = 32 bits byte, B 1 byte = 8 bits Mega, M... -
Page 7: Table Of Contents
ML7456N LSI Hardware Design Manual Table of Contents NOTES ..................................ii Introduction .................................. iv Notation ..................................v Table of Contents ............................... vi Decoupling capacitors ............................7 Circuit component values on the board ......................8 2.1. Notes on the crystal oscillator circuit configuration ..................8 2.2. -
Page 8: Decoupling Capacitors
ML7456N LSI Hardware Design Manual Decoupling capacitors Notes the following when placing decoupling capacitors: The VDD and GND traces should be wider than other signal line traces to reduce the resister element. Decoupling capacitor should be placed as close to an LSI pin as possible. The distance between the decoupling capacitor and pin is recommended less than 2mm. -
Page 9: Circuit Component Values On The Board
ML7456N LSI Hardware Design Manual 2.1. Circuit component values on the board It is recommended to request the quartz crystal manufacturer to acquire matching characteristics on the actual substrate. For reference, Table 1.1 shows the matching values in the Figure 1.1 configuration example on the Lapis Technology evaluation board. -
Page 10: Tcxo Circuit
ML7456N LSI Hardware Design Manual Table 1.2 Frequency deviation to support various standards Standard Frequency deviation RCR STD-30 type III (Japan) ±10 ppm RCR STD-30 type IV (Japan) ±4 ppm ARIB STD-T108 (Japan) ±20 ppm Wireless M-Bus N mode ±1.5kHz(8.852ppm , 4.8kbps) ±2.0kHz(11.803ppm, 2.4kbps) Wireless M-Bus F mode ±16 ppm... -
Page 11: Debugger Interface
ML7456N LSI Hardware Design Manual Debugger Interface Please refer to "ML62Q1000 Series User's Manual" Chapter 28, On-Chip Debug Function. Integrated ADC Please refer to "ML62Q1000 Series User's Manual" Chapter 23, Successive Approximation Register based A/D Converters. Please refer to "ML62Q1000 Series User's Manual" in Chapter 12, I2C Bus Unit and Chapter 13, I2C Bus Master. -
Page 12: Vco
ML7456N LSI Hardware Design Manual Figure 7.1 shows a configuration example of the VCO tank circuit. VCO oscillator frequency (F) calculated as follows. Refer to Table 7.2 about the relationship between the frequency bands and the oscillation frequency. 2 The L in the above equation will be the sum of the inductor L1, the line inductance of the PCB and the internal inductance of the ML756N. -
Page 13: Adjusting Component Values For Vco Tank
ML7456N LSI Hardware Design Manual Adjusting component values for VCO tank 7.1. Adjustment procedure of the VCO tank components is as below: 1. Execute the VCO calibration with the following condition. Set the frequency to the center of using frequency range. ... -
Page 14: Note On The Vco Tank Circuit
ML7456N LSI Hardware Design Manual Note on the VCO tank circuit 7.2. Note the following when designing the VCO tank cercuit. The characteristics of the VCO may vary depending on the PCB routing capacitance and wiring inductance. For stable operation of the VCO, keep the VCO tank constants (L1, C1) as close to the IND1 (#41) and IND2 (#43) terminals as possible, and wire them so that they are of equal length. -
Page 15: Pll Loop Filter Value
ML7456N LSI Hardware Design Manual PLL loop filter value Figure 8.1 shows a configuration example of the PLL loop filter circuit. C4 and R2 values depend on the data rate to satisfy phase noise feature. The recommend values are listed in Table 8.1. It is recommended to select the components with flat temperature characteristics and temperature coefficient is managed. -
Page 16: Rf Matching Circuit
ML7456N LSI Hardware Design Manual RF matching circuit 9.1. Transmit/Receive Separation Matching Circuit Figure 9.1shows an example of an RF matching circuit configuration. The PA_OUT (#29) terminal is biased at the REG_PA (#31) terminal through a choke coil. In order to suppress harmonics, LPF (Low Pass Filter) and traps are configured near the antenna. -
Page 17: Selection Of Components
ML7456N LSI Hardware Design Manual 10. Selection of components 10.1. Antenna It is recommended that the antenna to be used meets the characteristics shown in Table 10.1 Select the one with the most directional characteristics according to the usage conditions, environment, and mounting conditions. -
Page 18: Example Circuit Diagram
ML7456N LSI Hardware Design Manual 11. Example circuit diagram This chapter provides examples of circuit diagrams for each frequency band. Please note that fine adjustment may be required depending on the customer's board pattern and the components used. In addition, please follow the following in board design. ... - Page 19 ML7456N LSI Hardware Design Manual FJXL7456NDG-01...
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Page 20: Bill Of Materials
ML7456N LSI Hardware Design Manual 12. Bill of Materials The following table shows the bill of materials for 20mW transmission circuit for ML7456N at 920MHz band. Designator Comment Description Remarks Value Capacitor chip size: 0603 1000pF Capacitor chip size: 0603 0.1uF Capacitor chip size: 0603... -
Page 21: Revision History
ML7456N LSI Hardware Design Manual Revision history Page Release Document No. Content Before After Date revisio revisio – – FEXL7456NDG-01 2023.3.17 Initial Release FJXL7456NDG-01...
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