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4. PRE·OPERATION SETIING AND PROCEDURE
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4. PRE-OPERATION SETIING AND PROCEDURE
4.1 Master Module Handling Instructions
(1) Do not subject to the master module to impact or shock.
(2) Do not remove printed circuit boards from the housing. There
are no user-serviceable parts on the boards.
(3) Ensure that no conductive debris can enter the module. If it
does, make sure that it is removed. Guard particularly against
wi re offcuts.
(4) Tighten module mounting screws (optional) to 8(6.93)-
14kg·cm(12.1Ib·inch) torque.
(5) To load the module onto the base, hook the two lower lugs
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into the cut out and gently swing the module into place.
Ensure that the top catch engages. To remove the module,
press the top catch and swing the module out before
unhooking the lower lugs. (For further details, see the
corresponding CPU User's Manual.)
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