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| KEY ADVICE ON OPERATION |
. When Nozzle happens to contact the SMD, it is likely to come up and to be in the
waiting situation. In this case, please push Start button again for Nozzle to come
|
down.
When removing the small BGA & OFP less than 15mm, it is advisable to set the
nozzle to the maximum height.
. The vacuum tweezers is designed to be used like a pen. Please hold it like a
pen for more easier usage.
When the solder is oxidized, more attention should be paid because the solder
melting is hard to identify.
. There will be quite a difference in the time required for removal
in the first
operation (The heater is cool at start) and in the second after (The heater is
already warm). Please pay attention to that.
When PCB is bent or warped due to the large size, please put the PCB support
pin underneath the SMD. When
it is bent upward, please adjust the height of
Nozzle by Knob Z not to hit the bent PCB.
Remove the SMD by the metal twizzers when it is bonded.
When the small components like 1005 are mounted around the removing SMD,
please use Mode "LOW". However, if you find that the heating volume of Mode
"LOW"
is in shortage, please use Mode
"STANDARD"
after seperating the
nearby parts by putting the metal frame or the masking tape.
When the PCB holders are unusable because of connectors on PCB, please use
the PCB support pin.
10.Since the ceramic board is weak for heating impact, it is better to put the board
on an Aluminum plate of 1mm thick.
11.In
the
reworking
of
PBGA
(Plastic
BGA),
it is advisable
to
activate
the
Temperature Knob at calibration of 3 to 4.
12.For the removal of the large sized SMD more than 30mm, an option of the metal
frame will be more useful.
13.For the removal
of PGA
& DIP, more
efficient works will be done when
the
molded side is preheated at 120°C.
14 if the connecter is made with heat-plasticity, it is not easy to remove it without
melting or damaging
it. However TF-350
can do it well while it is impossible
with other equipment.
15.In handling the flexible PCB or the film board, please put it on another board
where there is no mounted parts. Then, proceed the works on it.
16.Do not rely on the timer so much. It sometimes will cause failure in continuous
works.
17.The removal time varies according to the conditions.
i.e.: continuous or intermittent works, the size of SMD and the sorts of board.
Please pay attention to the timer setting.
18.The small PCB is apt to move itself. It will be easy to do the works when you put
a weight on the small PCB.
19.Do not turn Mode Knob in the operation. If the Mode is changed in the operation,
it is possible that Nozzle
makes
a false movement
because
the last Mode
program is memorized in the computer. When you wish to change Mode, be sure
to push Stop button to return to the starting position then select a Mode you
want.
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