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MMODE SELECTION 8 APPLICATION
MODE |
AIRFLOW |
NOZZLE MOVE
APPLICATION
INDEX OF HEATER SETTING
FAST
REMOVAL FOR
QFP/PLCC/SOP/
STANDARD)
12 L/MIN.
|
A
SOP
3
7
2
8
FAST
REMOVAL FOR
FOER
QFP/PLCC/SOP
TEMP
LOW
6 L/MIN.
+ RECOMMENDABLE FOR
DENSE PCB WITH THE
SMALL COMPONENTS.
# AT THE POSITION OF 'HIGH',
MOST PROPER TEMPERATURE
FAST
REMOVAL 8
IS AVAILABLE FOR REMOVAL.
PGA
SOLDERING
FOR
HOWEVER, YOU CAN LOWER
PGA/BGA
THE TEMPERATURE AT WILL
BGA
12 L/MIN.
Г]
/8G
IF NECESSARY.
ー
* AT SOLDERING, IT IS ADVISABLE
TO ACTIVATE AT CALIBRATION
OF 3705
SLOW
SOLDERING
*1/10 OF FAST
SLOW
6 L/MIN.
ση
|
A
Lol
MREMOVAL
OF BGA/PGA
BGA/PGA
Outside circuit
One(1) cycle composes of five(5) circuits
with starting at © and ending at ©.
The cycle will be repeated.
BGA/PGA
REMOVAL METHOD OF PGA IN "PGA/BGA"
MODE
STEP 1 — Set Mode Knob in "PGA/BGA".
Nozzle
This illustration shows
that Nozzle is circled
over the pins of PGA
by 5
Metal frame
(Option)
CJ
(Option)
STEP
2
- Seeing the solder melting, push down the reverse side of PCB evenly by the metal tweezers or
others so that the pins points are on the level of the reverse face of PCB.
STEP 3 — When the pins points were down to the level of the reverse face of PCB, please pull it down evenly
by the jig.
STEP 4 - The PGA will be removed.
Metal frame and Jig are optional parts.
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