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REMOVAL OF SMPGA (WITH HEAT SINK) IN "STANDARD" MODE
SMPGA
FLOW OF HOT AIR
'
'
| METAL FRAME(OPTION)
SMPGA
| REMOVAL OF SMPGA WITH A ROUND SHAPED HEAT SINK |
1. Set Mode Knob in "STANDARD"
2. Place a square Metal frame with the side dimension of 50 mm around SMPGA.
3. The tip of Nozzle is to be below the top of Heat sink as illustrated above.
Push Start button and tentatively set the tip end of Nozzle in a position so that the rotation of "X" and "Y"
can be larger than the diameter of Heat sink.
And place PCB on the PCB holders not to hit the tip end of Nozzle.
4. Adjust the width of "X" and "Y" so that the tip end of Nozzle can rotate between the circumference of
SMPGA
and Metal frame as illustrated above.
5. After the position setting, push Start button again.
6. With the hot air flowing into the pins from the clearance of the bottom face of SMPGA and PCB, the solder
will start melting.
REFLOW METHOD OF QFP IN "SLOW" MODE
STEP 1
Remove a SMD in "STANDARD"
or "SLOW" mode
STEP 4
Put a new SMD on the pattern
and position it accurately.
"SLOW"
7
|
STEP 6
Solder it in mode of "SLOW".
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STEP 2
STEP 3
Completely
remove
the
solder
Place
cream
by a dispenser
or
remained
on the face of pattern
others.
by SC-7000 to clean the face.
STEP
5
Fix the two points tentatively by
a solder iron as illustrated above.
(Use a finger to push the SMD
lightly so that it can not float)
REMARKS
2 circuits in mode of
At Step 2, if the solder remained on the pattern is com-
paratively new and usable, it is advisable to re-use the
remained solder and to flatten it by a solder iron. In this
case, place a little of flux on the pattern, then accurately
position a new SMD on the pattern while the flux is wet
(before the flux is dried).
The flux will be hardened when it is dried. When re-using
the remained solder, please do Step 5& 6 after Step 2.
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