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MCONTROL
PANEL
START BUTTON
a
MODE KNOB |
| [AO
BGA
STOP BUTTON
ù
^
一 KNOB-Z AXIS]
Y
SES
TIMER KNOB
一 一
in
x
Ap
KNOB-X AXIS
t
WIDTH
O INSIDE
QFP/PLCC
mm
PGA/BGA |} QI
[NOZZLE 一 一 一 一
MPRESTART
1. Turn on the power switch
2. Tum
right(clockwise) Knob Z to the maximum
to raise the nozzle to the highest position.
3. Set Timer Knob at max. of 5 min.
4. Set Temperature Knob in "high" position
5. Set Mode Knob in STANDARD
6. Place a PCB on the PCB holders and adjust Base Plate so that the removing QFP can be positioned right
under Nozzle.
MTEST-RUN
(POSITION SETTING)
7. Push START
button one time to lower Nozzle
8. Turn left(counterclockwise) Knob Z to lower Nozzle so that Nozzle point can be 1 mm above the surface
of QFP.
9. Decide the width X and length Y by Knob X and Knob Y so that Nozzle can circle right over the solder
face of QEP.
10. Check
6, 8 and 9 above again if needed to get the right position setting.
MSTART-REMOVAL WORKS
11. Push START button once more to switch on the heater. And the air flow will start melting the solder face.
12. The vacuum
tweezers will be usable while the air blow is on.
13. You
can see the solder glitter and start melting.
14. At the solder melted, place a finger on the hole of the tweezers and let the tweezers suck the surface
of QFP.
15.Be sure to push STOP button. Nozzle will be raised up and Heater will be off. In 20 seconds, the air pump
will be automatically stopped with Nozzle cooled down.
16.When
you want to heat Nozzle again, push START
button agein.
ー3 ーー
MREMOVAL METHOD IN "STANDARD" MODE
MODE : CHOICE
SLOW-LOW-STANDARD-PGA/BGA |
INDEX OF SETTING POSITION OF
NOZZLE POINT (X-Y-Z)
Adjust a distance by a
"re
Nozzie will be
raised in highest position
when Knob Z
is turned
right to the maximum
Imm
(7
Ú
JAF
(QFP)
| X's width
Y's length
YA
.
mae
73
Figure1
(PLCC)
X
EA
STEP 4
When
the setting time of
Timer is due, Nozzle
will
be
automatically
raised up. When
Timer is not in use,
Nozzle will be
raised up by pushing
button of 2!
STEP 3
TEST RUN (POSITON SETTING)
In order to circle over the circumference
of QFP,
Nozzle point can be set by placing
a PCB
with slight movement
of Base
Plate
2
and by deciding X's width (right & left) and
SMD
ol
Ys length (back & forth)that is shown in Figure1
(QFP)
中
START]
+
When the button of [lis pushed once more,
the hot air will start blowing.
STEP1
STEP 2 _
This removal method
is
When
the button of
ilustrated in "STANDARD"
E (green color) is
Mode
pushed one time,
Turn right
Timer Knob
Nozzle will be
to the maximum
when
lowered. Adjust up
Φ
Timer is not in use.
& down
by
Knob Z.
STEP 5
When
the solder starts
melting, please suck
and remove QFP by the
<
tweezers after placing
a finger on the hole.
STEP 6
In approx.
20 seconds, the
pump will be
automatically
stopped with
Nozzle cooled
down.
Tweezers
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