Sony UDA-1 Service Manual page 3

UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
System requirements for computers connected to the USB DAC AMPLIFIER
To output sound played back on a computer via the USB DAC AMPLIFIER, download the
required driver, then install it on your computer.
However, in Mac OS, install the driver is unnecessary.
The following system environment is required to install the driver:
OS
Windows 8 (32 bit/64 bit)
Windows 7 (SP1, 32 bit/64 bit)
Windows Vista (SP2, 32 bit/64 bit)
Windows XP (SP3, 32 bit/64 bit)
(Mac OS X v10.6.8, 10.7.4, 10.8)
Device
USB port (USB 2.0 compliant)
Note
One of the above operating systems should be installed by default. Upgraded operating
systems and multi-boot environments are not supported.
We do not guarantee operation for all computers even if they meet the above system
requirements. Furthermore, the following systems are not supported:
Personally constructed computers or operating systems
Upgraded operating systems
Multi-boot environments
Multi-monitor environments
ABOUT THE CONFIRMING OF OPERATIONS
To perform confi rming of operations of this unit, it is necessary to
install a USB driver and Hi-Res Audio Player in PC, to connect PC
to this unit, and to perform confi rming of operations.
Please refer to the Quick Start Guide for install of USB driver and
Hi-Res Audio Player.
NOTE OF REPLACING THE IC203, IC204, IC402,
IC501 AND IC508 ON THE DIGITAL BOARD
IC203, IC204, IC402, IC501 and IC508 on the DIGITAL board
cannot exchange with single. When this part is damaged, exchange
the complete mounted board.
NOTE OF REPLACING THE IC201 ON THE DIGITAL
BOARD
Replacement of IC201 on the DIGITAL board used in this unit
requires a special tool.
SECTION 1
SERVICING NOTES
NOTE OF REPLACING THE IC350 AND IC351 ON
THE AMP BOARD AND THE COMPLETE AMP BOARD
When IC350 and IC351 on the AMP board and the complete AMP
board are replaced, it is necessary to spread the compound between
the IC350, IC351 and the heat sink, chassis and the heat sink.
Description
THERMAL COMPOUND (G747)
Spread the compound referring to the fi gure below.
– AMP Board (Component Side) –
– State that removed the heat sink –
– Heat sink bottom –
IC350 IC351
UDA-1
3