Toshiba MCY-MHP0506HT-C Service Manual page 165

IPDU P.C.board
(43H69201)
① Single-touch spacer
② Screw
(M4×14)
P.C.board
First remove the
Screws ②, and then
remove the P.C.
board assembly.
④ Screw (M4×8)
Used to secure the lead wire
Screw tightening torque: 1.2 ±0.1 N•m
⑤ Screw (M3×20)
Used to secure the IGBT , IPM and rectifiers
Screw tightening torque: 0.55 ±0.1 N•m
③ Card spacer
Push this in the direction of the
arrow to unlock and remove the
P.C. board assembly.
P.C.board
③ Card spacer
④ Screw (M4×8)
Used to secure the lead wire
Screw tightening torque: 1.2 ±0.1 N•m
⑤ Screw(M3×20)
Used to secure the rectifiers
Screw tightening torque: 0.55 ±0.1 N•m
④ Screw (M4×8)
Used to secure the lead wire
Screw tightening torque: 1.2 ±0.1 N•m
⑥ Screw (M4×15)
Used to secure the IPM
Screw tightening torque: 1.2 ±0.1 N•m
① Single-touch spacer
② Screw (M4×14)
Evenly apply the silicon heat sink compound to the heat-sink
surfaces of the IPM , IGBT and rectifier devices.
Caution: It must be ensured that no dust, etc. adheres to the
heat-sink surfaces of the IPM , IGBT and rectifier devices.
Standard for heat silicone heat sink compound:
Manufacturer: Shin-Etsu Chemical Co., Ltd.
Type: G746 or G747
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