1. Product introduction ..................................................................................................3
2.1 Features .................................................................................................................. 4
2.2 Solution advantage ................................................................................................. 4
3. Application scenarios ................................................................................................. 5
4. Hardware description ................................................................................................ 6
4.1 Dimensions .............................................................................................................6
4.2 Pin definition .......................................................................................................... 7
5. Use and configuration ................................................................................................8
6.1 Install software ..................................................................................................... 13
6.2 Instructions ........................................................................................................... 13
6.3 Bluetooth password ..............................................................................................13
6.4 OTA upgrade ........................................................................................................ 13
8.3 Common materials ............................................................................................... 18
9. Revision records ....................................................................................................... 19
HLK-LD2410C
Shenzhen Hi-Link Electronic Co., Ltd.
Content
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Manual
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