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HP 5130 48G 4SFP+ XI Product End-Of-Life Disassembly Instructions page 2

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Tool Description
Phillips screwdriver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Unscrew the screws and remove common mout angle component 4, power 1 or blank panel 1, fan 2, blank panel 3.
2.
Unscrew the screws and remove top cover 5.
3.
Remove label 5-2 from top cover 5-1.
4.
Unscrew the screws and remove air deflector panel 6.
5.
Remove fan connector 7 from bottom shell 11.
6.
Unscrew the screws and remove pcb 8 from pcb 10.
7.
Remove lamp guide 9 from pcb 10.
8.
Unscrew the screws and remove pcb 10 from bottom shell 11.
9.
Remove film 12 from bottom shell 11.
10. Unscrew the screws and remove hexagon stud 13 from pcb 10.
11. Remove heat sink mounting kit, then remove heat sink 10-2 from pcb 10-1.
12. Remove shading foam 14 from pcb 8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
MF877-00
Template Revision A
HPE instructions for this template are available at
Tool Size (if
applicable)
MF877-01
2#
Page 2

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