Murata XBSC Series Assembly page 10

XBSC/UBDC/UBSC/BBSC/ULSC 100 µm & 400 µm -
Assembly by soldering
PROFILE FEATURE
Preheat/soak
Temperature min (Ts min)
Temperature max (Ts max)
Time (ts) from (Ts min to Ts
max)
Ramp-up
Ramp-up rate (tL to tp)
Liquidus temperature(TL)
Time (tL) maintained above TL
Peak temperature (Tp)
Time 25°C to peak temperature
Ramp-down
Ramp-down rate (Tp to TL)
Flux removes tarnish films, maintains surface cleanliness and facilitates solder spread during attachment operations.
The flux must be compatible with the soldering temperature and soldering times. In case of water soluble flux, please
refer to the solder paste supplier for the cleaning and flux removal. Flux residues could be responsible for current
leakage or short circuits. For optimum results, clean the circuits immediately after reflow.
Assembly Note – Ref : ASNUBSC1.6
FBC-0003-01
Figure 3: Generic reflow profile according to JEDEC J-STD-020-C
SnPb 63/37
100°C
150°C
60 to 120 s
3°C/s maximum
183°C
60s to 150 s
220°C
6 minutes maximum
6°C/s maximum
SAC305 (Lead-Free Assembly)
150°C
200°C
60 to 120 s
3°C/s maximum
217°C
60s to 150 s
260°C
8 minutes maximum
6°C/s maximum
Rev 1.2
Rev. 1.6
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