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radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Screw driver
Continuous vacuum desoldering system
Desoldering tip
Damp sponge
Flux-cored solder
tweesers
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove shielding finger 2 from filler panel 1.
2. Remove film 3 from filler panel 1.
3. Unscrew the screws on radiator 4, and then remove radiator 4.
4. Unscrew the screws on PCB 6, and then remove PCB 6.
5. Unscrew the screws on part 5, and then remove part 5.
6. Unscrew the screws on PCB 7, and then remove PCB 7.
7. Remove conformal coating (if any) and clean work area of any contamination, oxides, adhesives, residues or fluxes.
8. Install thermal drive desoldering tip handpiece.
9. Start with tip temperature of approximately 315°C and change as necessary.
10. Thermal shock tip with damp sponge.
11. Tin tip with solder. (See Figure 2.)
12. Confirm complete solder melt of contacted lead. (See Figure 3.)
13. For a flat lead, move lead back and forth; for a round lead, use a circular motion and apply vacuum while continuing
lead movement. (See Figures 4&5.)
14. Lift tip from lead, hold vacuum for an additional 3 seconds to clear all molten solder from heater chamber. (See Figure
6.)
15. Repeat for all solder connections.
16. Re-tin tip end with solder and return handpiece to its stand.
17. Lift the component body free of the printed board.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
Tool Size (if
applicable)
2#
Page 2
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