Panasonic Grid-EYE AMG88 Series Manual page 8

(9) The sensor can continuously operate within the range of using ambient temperature (using ambient humidity). However,
ensure that humidity is within the range described in the following page as humidity varies according to temperature.
Avoid the continuous operation near the operational limit. The temperature range does not guarantee the durability.
Humidity (%RH)
Avoid
freezing
at 0 ℃
32 ℉
or below
－20
4. Mounting
Use the land of the printed-circuit board on which the sensor is securely fixed. The recommended printed-circuit board is FR4
(thickness 1.6 mm 0.063 inch). When mounting the product on a printed circuit board other than the recommended one,
be sure to check the performance and quality before using the product.
(1) A large noise on the power supply may cause malfunction. Place the recommended capacitor near the sensor
(within 20 mm 0.787 inch of the wiring pattern length) between sensor input terminals (VDD-GND) to secure power
superimposed noise resistance. Be sure to check on the actual equipment and re-select the optimal capacitor capacity.
(2) Prevent the metal part of other electronic components from contacting with the sensor body as the upper face
(where part numbers are imprinted) of the sensor is GND.
5. Soldering
Due to the thermal capacity of the infrared array sensor is low, therefore, take steps to minimize the effects of external heat.
Damage and changes to characteristics may occur due to heat deformation.
5.1 Manual soldering
Set the soldering tip from 350 to 400 ℃ (30 - 60 W), and solder within 3 seconds or less. Note that output may be changed
if the load is applied to the terminals when the soldering carefully clean the tip of soldering iron.
5.2 Reflow soldering
5.2-1 Solder coating
We recommend the screen solder printing method as the method of cream. Halogen type (Chlorine type, Bromine type
, etc.) or other high-activity flux is not recommended as the residue may affect performance or reliability of resistors.
5.2-2 Mounting of sensor
Self alignment may not always work as expected, therefore, be carefully the position of the terminals and pattern.
5.2-3 The recommended reflow temperature profile
The recommended reflow temperature profile conditions are given below. The temperature of the profile is assumed to be
a value measured with the printed wiring board of the product terminal neighborhood. The temperature of PCB near this
product terminal at the time of mounting changes depending on PCB design. The temperature of the printed circuit
board near the terminal of this sensor when mounted may change depending on the design of the printed circuit board.
Therefore, confirm that the temperature of the printed circuit board near the terminal of this sensor is the specified profile
temperature when mounted.
5.3 Solder reworking
Finish reworking in one operation for reworking of the solder bridge, use a soldering iron with a flat tip do not add more flux
when reworking Refer the conditions of manual soldering to rework.
5.4 Coating of PCB
To prevent the insulation of the PC board after soldering, not to place the chemicals on lens of the sensor when coating.
Hi gain type
85
Tolerance range
Avoid dew
condensation at
0 ℃ 32 ℉ or below
15
0
80
Temperature (℃ ℉)
T
3
T
2
T
1
t
1
Infrared Array Sensor Grid-EYE (AMG88)
Humidity (%RH)
Avoid
freezing
at 0 ℃
32 ℉
or below
T ＝150 to 180 ℃
1
T ＝230 ℃ 446 °F
2
＝Below 250 ℃
T
3
t ＝60 to 120 s
1
t
2
Low gain type
85
Tolerance range
Avoid dew
condensation at
0 ℃ 32 ℉ or below
15
0
－20
Temperature (℃ ℉)
302 ℉ to 356 ℉
482 ℉
80
10-Feb-23