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2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description
Screw driver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Unscrew the screws on heat sink 3, and then remove heat sink 3 from panel 5.
2. Unscrew the screws on pcb 1, and then remove pcb 1.
3. Unscrew the screws on guiding set 2, and then remove guiding set 2 from pcb 1.
4. Remove shielding finger 4 from panel 5.
5. Remove film 6 from panel 5.
6. Remove battery from pcb 1.
(a) Remove conformal coating (if any) and clean work area of any contamination, oxides, adhesives, residues or
fluxes.
(b) Install thermal drive desoldering tip handpiece.
(c) Start with tip temperature of approximately 315°C and change as necessary.
(d) Thermal shock tip with damp sponge.
(e) Tin tip with solder. (See Figure 2.)
(f) Lower tip contacting solder connection.
(g) Confirm complete solder melt of contacted lead. (See Figure 3.)
(h) For a flat lead, move lead back and forth; for a round lead, use a circular motion and apply vacuum while
continuing lead movement. (See Figures 4&5)
(i) Lift tip from lead, hold vacuum for an additional 3 seconds to clear all molten solder from heater chamber. (See
Figure 6.)
(j) Repeat for all solder connections.
(k) Re-tin tip end with solder and return handpiece to its stand.
(l) Lift the component body free of the printed board.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
Figure 1 disassembly process
Tool Size (if
applicable)
2＃
Page 2
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