Table of Contents
Advertisement
RM-839; RM-840; RM-841
System Module
Electronic interface between Baseband and memory card
The eMMC/MMC – SD interface of X-GOLD614 is used for external data storage on an SD card. The SD card
densities supported are SDSC (standard capacity < 2GB), SDHC (up to 32GB). A range of bus speeds are
supported. Quark lead product supports the DS (12.5MB/s) and HS (25 MB/s) speed modes. They are based on
2.85V I/O and the use of the internal VMMC.
The X-GOLD614 MMC interface is connected to the SD-card connector through some EMI filtering and ESD
protection components.
User interface
Electronic interface between Baseband and display
The Display Content Controller consists of two parts, Display Interface (DIF) and Graphic Accelerator (GRA).
DIF and GRA share the TOPSPIN compliant AHB slave interface including TX/RX fifos. The GRA uses two AHB
master interfaces to access external or internal memory.
The DIF module enables the processor to communicate with an external display that has one of the supported
interfaces.
The following features are supported by the Display Interface:
• High speed parallel interface with programmable timing requirements (MIPI DBI-B 2.0 support)
• Multiple input formats possible: RGB up to 32 bit/pixel
• Hardware accelerator for physical protocol (pixel-bit conversion) allows to generate all common output
formats for various color depths, for example (R,G,B) =(3,3,2), (4,4,4), (5,6,5), (6,6,6), (8,8,8).
• Evaluation of synchronization signals from display to eliminate tearing effects.
The GRA module supports the baseband processor to speed up 2D graphic operations. It contains:
• Hardware acceleration for lines, filled rectangles, bitblt, scrolling/moving
• Hardware acceleration for clipping and alpha blending (interleaved alpha, alpha/stencil buffer, chroma
keying)
Issue 1
Figure 47 SD interface
NOKIA INTERNAL USE ONLY
Copyright © 2013 Nokia. All rights reserved.
Page 6 – 19
Advertisement
Chapters
Table of Contents
Troubleshooting
