Page 1
K465i GaN Operations and Maintenance P/N 1212831 Rev C June 2012...
Page 2
Veeco Technical Publications has carefully reviewed this document to ensure its reliability and completeness. If you discover any errors or omissions, please contact: Veeco Technical Publications mailto:techpubsnj@veeco.com...
Interlock Override Safety Notice ................1-9 Safety Switches ....................1-10 1.2........1-13 ECTION NSTRUCTIONS AND ROCEDURE Type and Magnitude of Energy ................1-13 CHAPTER 2. TURBODISC K465I GAN MOCVD SYSTEM SPECIFICATIONS ................. 2-17 2.1..............2-17 ECTION ENERAL PECIFICATIONS Company Address .................... 2-17 System Specifications ..................
Page 5
K465i Operations and Maintenance P/N 1212831 Rev C Pyrocontrol Introduction ................... 4-39 Description of PyroControl ................4-40 Using PyroControl for Temperature Control On K465i GaN Systems ....... 4-41 4.8.............. 4-41 ECTION OBOT ETUP AND DJUSTMENT Procedures in this Section ................. 4-42 Reference Drawings ..................
Page 13
About This Document This documentation set includes the operating and maintenance manual for a Veeco TurboDisc K465i GaN MOCVD System (referred to as K465i within the text of this document). Within this manual are operating instructions to start-up and shut-down the system under various conditions, loading and unloading of wafers from the wafer carrier and transport of the wafer carrier into and out of the growth chamber.
SAFETY SUMMARY This section contains important safety information regarding the operation and maintenance of the K465i GaN system. Topics covered include general safety, warning, caution and note usage, symbol usage, general precautions, hazardous materials, safety interlocks and alarms, safety switches, and lockout/tagout instructions. These general safety notices supplement the specific warnings and cautions appearing at the start of each section.
Warnings and cautions appearing throughout this manual are of paramount importance to personnel and equipment safety. Prior to attempting to operate, maintain, troubleshoot, or repair any part of the K465i GaN system or related equipment, all warnings and cautions should be thoroughly reviewed and understood. The following paragraphs define warnings, cautions, and notes as they are used in this manual.
when they are performing maintenance on equipment containing static-sensitive integrated circuitry. Veeco recommends, as a two-person task, removal of the plastic cover of the main electrical cabinet. Assume, until verified otherwise, that the reactor is too hot to be opened. Do not ...
The batteries used in the APC uninterruptible power supply (UPS) contain Lithium. Dispose of replaced cells or old units in accordance with local regulations for disposal of Lithium. Fluorescent lights bulbs used on the K465i GaN system may contain mercury. Dispose of used and old lightbulbs in accordance with local regulations.
Page 21
Table 1-1 below. The list is based upon general system usage. Customized or special applications may utilize or generate additional chemicals not included in this list. Table 1-1. List of chemicals anticipated to be used or generated by K465i GaN . CHEMICAL SOURCE...
P/N 1212831 Rev C SAFETY INTERLOCKS AND ALARMS The following safety interlocks and alarms (Table 1-2) are present in the K465i GaN. Most system sensors generate a software alarm condition that shuts the system down. For some critical systems there is a hardware shutdown (EMO), independent of the software shutdown that is initiated upon an alarm condition.
K465i Operations and Maintenance P/N 1212831 Rev C SAFETY SWITCHES A description, including the location, of safety switches on the K465i GaN is listed in Error! Reference source not found.. The Electronics Control Assembly shows the location of these safety switches, as well as the location of the main power breakers and other energy isolation devices.
This procedure establishes the minimum requirements for the lockout of energy isolating devices whenever maintenance or servicing is done on a K465i GaN system. It is used to ensure that the system, or components, are stopped, isolated from all potentially hazardous energy sources, and secured before technicians perform any servicing or maintenance.
Page 28
3. Obtaining Lockout/Tagout device: Select the proper lockout / tagout device for the hazardous energy source being controlled. 4. System shutdown: The machine or equipment shall be turned off or shut down using the K465i GaN System Shutdown procedures. Warning: An orderly shutdown must be utilized to avoid any additional or increased hazard(s) to employees as a result of the equipment stoppage.
K465i Operations and Maintenance P/N 1212831 Rev C CHAPTER 2. TURBODISC K465I GAN MOCVD SYSTEM SPECIFICATIONS This chapter includes general system and seismic specifications for the TurboDisc K465i GaN MOCVD System. Refer to the System Footprint drawing for additional information regarding system specifications and installation.
K465i Operations and Maintenance P/N 1212831 Rev C Figure 2-1. K465i GaN Cabinet Section 2.2. Seismic Specifications Note: The calculations below are not a complete seismic analysis. A complete analysis might also include such factors as: stress distribution through a multiple-fastener connection;...
Doc 1100481 Rev C CHAPTER 3. SYSTEM OVERVIEW This chapter includes a high-level view of the system components and the K465i GaN system’s function. Figure 3-1. K465i GaN MOCVD At the core of the Veeco TurboDisc™ MOCVD products is a process for fabricating microelectronic devices based on engineering developments and principles.
Figure 3-3. K465i GaN System Assembly The K465i GaN depicted in Figure 3-3 above can be used for blue, green and ultraviolet (UV) LEDs, solar cells, FETs and blue spectrum laser production. The K465i GAN is divided into separate modules, assembled separately on separate wheeled frames, then mounted together, placed on metal feet and the casters are removed.
Page 40
K465i GAN. There is an efficient and easily-manageable upper exhaust system for all modules. The bottom level of the entire K465i GAN includes separated lines for high power, with lines for low and digital power lines along the upper area of each module, under the mezzanine level.
DEVICENET NETWORK See DeviceNet Vendor documentation The DeviceNet ToolBox enables setup, configuration and troubleshooting of Veeco TurboDisc MOCVD control systems, based upon PLC controllers and DeviceNet communication protocols. DeviceNet operates through the use of and internal Ethernet/IP common industrial protocol (CIP) over Ethernet. The DeviceNet ToolBox is designed to work as a standalone application, and does not require any additional software.
Process Control HMI – Human Made Interface The NEXUS Main Operation Window displays a gas flow diagram of the K465i GaN and serves as a Graphical User Interface (GUI). From this window, users can: set valve positions ...
Section 3.10. In-Situ Monitoring The In-Situ Monitoring device for the K465i GaN is mounted above the reactor, within the Reactor Module. The DRT-210 is an integrated real-time in-situ process monitoring system of epitaxial growth on TurboDisc GaN MOCVD reactors. The acronym, DRT, is derived from...
(used) water. Section 3.12. Alarms and Interlocks The K465i GaN Alarms function on three levels, each level connected to others while functioning independently (see Chapter 1, Safety Summary): Software Alarms PLC (Primary Logic Controller) Alarms ...
K465i Operations and Maintenance P/N 1212831 Rev C Section 3.13. system Processes For operations and maintenance of Veeco Turbodisc systems, we provide detailed process descriptions within the user documentation. The documented system processes include the following: System Setups – System Readiness Checklist ...
Nexus User Manual where needed. Section 4.1. K465i GaN System Startup This section describes the system startup of the K465i GaN system following a shutdown. The procedures included in this section apply to: a daily system startup establishing system readiness ...
DAILY STARTUP AND SYSTEM READINESS Although every manufacturing location must prepare for equipment shutdown and restart, the ideal working schedule for the K465i GaN system is a non-stop production arrangement, with cyclical scheduling of system readiness preparation and testing. Such an arrangement allows for consistent production with enough time between runs for adequate system checks, for resupply of chemicals and replacement parts and for safety tests.
This section contains a summary of basic operating procedures for the pumps used with the K465i GaN. The procedures are a synopsis of each pump’s operating manual. For a complete description of pump operation and maintenance procedures, please refer to the pump’s operating manual, located in the Vendor documents section of the documentation...
10. After setting the regulator pressure, lock it by pushing the red stopper on the regulator knob. Note: The N dilution mode option is not normally used with K465i GaN tools. The N Selector valve should be closed. 11. Turn on external power to the pump.
P/N 1212831 Rev C TURBO PUMP The (optional) Turbo Pump provides a high vacuum Transfer Hub option for the K465i GaN. This option consists of a turbomolecular pump, ion gauge, and associated plumbing to pump down the Transfer Hub with a standard vacuum pump, and then switch over to the Turbo Pump to achieve 10-7 torr.
The purifier has three operating modes as shown in Table 4-3. During normal operation, no manual adjustments to operating valves or the temperature controller is required. The K465i GaN control system provides the required combination of pneumatic control signals to activate the required mode of operation base on the state of the system.
Caution: Do not adjust the overtemperature alarms in the PID controller for the Eurotherm devices. It is essential that these settings remain as preset. The K465i GaN utilizes a customized version of the Eurotherm displays, not shown in Figure 4-6.
Page 116
Section 4.7. PyroControl Operation This section covers pyrometer temperature control of the K465i GaN system. Included is a description of pyrometer control, and the benefits of using this temperature control scheme. The procedure also details how to switch between different temperature control modes.
Precise control of temperature during the deposition process is key to maintaining material quality and repeatability of results. Due to the inherent difficulties associated with K465i GaN MOCVD growth, determining a reliable method for controlling process temperatures is a significant challenge. Because of the transparent nature of the sapphire substrates commonly used for the growth of high-brightness LEDs, thermo-radiance from the wafer surface cannot be directly measured.
P/N 1212831 Rev C DESCRIPTION OF PYROCONTROL To accommodate the 21 x 2” wafer carrier configuration used in the K465i GaN reactor, three pyrometers are attached to viewports on the flow flange. As shown in Figure 4-10, this configuration provides the pyrometers with a direct, unobstructed view of the carrier surface.
Robot Setup and Adjustment This section discusses the set up, operation, and maintenance for the robot wafer carrier transfer system used with the K465i GaN. Topics include set up, adjustment, and troubleshooting of the robot. Basic and advanced command sets are also included.
K465i Operations and Maintenance P/N 1212831 Rev C TROUBLESHOOTING Note: If you cannot determine why the robot transfer system is operating incorrectly, call Veeco TurboDisc Operations at 1-8TURBODISC. Symptom: Loss of power to robot controller. Actions: 1. Re-energize the robot controller.
Section 4.9. K465i GaN System Shutdown This section covers shutting down the K465i GaN system. Procedures are included describing techniques for shutting down the system overnight and for routine maintenance. The Maintenance Shutdown Procedure is the first step for all subsequent system maintenance procedures.
P/N 1212831 Rev C MAINTENANCE SHUTDOWN PROCEDURE The following procedure should be used to prepare the K465i GaN for maintenance. Because the system will be opened to outside air, all potentially hazardous gas must be removed from the reactor and from any feed lines that will be opened. Each feed line will first be evacuated of all gas.
P/N 1212831 Rev C Section 5.1. Routine Maintenance This section covers basic maintenance procedures for the K465i GaN system. While comprehensive, these procedures can be adapted for specific applications. Final maintenance procedures and safety practices should be based upon this manual, good laboratory practices, and any and all facility and government regulations.
Page 144
In particular the K465i GaN Safety Summary section at the beginning of this manual should be reviewed. At the start of each procedure there is also a Safety Precautions and Hazards Management section that outlines specific safety issues and hazards associated with that procedure.
The following outline forms the basis of all maintenance procedures used at Veeco Compound Semiconductor and documented in this manual. Specific procedural details are listed within each individual section in the manual. Please consult Veeco technical support or the facility safety officer with any questions regarding these principles.
Section 5.3. K465i GaN Reactor Chamber Maintenance This section covers maintenance to the K465i GaN reactor chamber. It includes disassembly, cleaning, and reassembly procedures as well as specific steps to prepare the system for maintenance. Basic system shut down and leak checking procedures are not covered in this section.
Uneven deposition on the reactor wall usually indicates an imbalance in the gas flow. Veeco TurboDisc recommends the taking of photographs of the chamber condition each time the reactor is opened, to support system maintenance records.
26. Vacuum the entire reactor chamber again. 27. Ensure that no tools and wipes have been left in or around the chamber. 28. If scheduled, proceed with flow flange disassembly and maintenance as described in K465i GaN Flow Flange Maintenance.
Page 192
19. When leak checking is finished, retighten the flow flange clamps until they are just snug. Do not over tighten. 20. Start up the system following the System Startup Following a Maintenance Shutdown procedure outlined in the K465i GaN System Startup section. 21. Perform a bakeout on the reactor. Note: It is recommended that a second leak check is performed after the bakeout, following the same proceedures used for the first leak check.
Section 5.4. K465i GaN Flow Flange Maintenance This section covers maintenance to the K465i GaN flow flange. It includes disassembly, cleaning and reassembly procedures. It assumes that the flow flange has been removed following the steps outlined in the previous section, Reactor Chamber Maintenance.
P/N 1212831 Rev C FLOW FLANGE DISASSEMBLY GUIDE Prepare the Flow Flange for disassembly by following the steps given in the Flow Flange Removal Procedure in the previous section, K465i GaN Reactor Chamber Maintenance. Procedure 5-7: Flow Flange and Shutter Disassembly Notes:...
Figure 5-55. Chamber Ready for Leak Checking 8. Close each manual valve (MV53 and MV54)above the Ebara pumps (see Figure 5-56). The system is ready to be leak checked. Follow sections 5-74 and 5-109 in the K465i GaN Operations and Maintenance CD for leak checking procedures.
Section 5.5. K465i GaN Heater Maintenance This section covers the removal and replacement of the K465i GaN heater assembly. All steps preceding the start of heater maintenance are covered in other procedures and are not covered in this section. Please refer to appropriate sections for the applicable procedures.
Page 257
19. When leak checking is finished, retighten the flow flange clamps until they are just snug. Do not over tighten. 20. Start up the system following the System Startup Following a Maintenance Shutdown procedure outlined in the K465i GaN System Startup section. 21. Perform a bakeout on the reactor. Note: It is recommended that a second leak check is performed after the bakeout, following the same proceedures used for the first leak check.
Page 258
The Wafer Handling Assembly (WHA) includes the frame for the THA, LFA, optional Glovebox, and the PEA. This section covers maintenance to the Transfer Hub chamber for the K465i GaN system. It includes disassembly, cleaning, and reassembly of the Transfer Hub chamber.
site-qualified technician must be present in the FAB during the maintenance procedure. Whenever maintenance or other system related functions are performed on Veeco TurboDisc systems, safety procedures must be followed, including the wearing of all required personnel protection equipment.
The following material related to the Robot maintenance and adjustment is a brief introduction to the detailed steps needed for these tasks. See Robot Setup on Veeco K-Systems for additional guidance. Figure 5-121. Alignment of the Robot Procedure 5-17: Aligning the Robot 1.
P/N 1212831 Rev C Section 5.7. Particle Filter Maintenance This section covers maintenance to the particle filters for the K465i GaN system. It includes system shutdown, disassembly, cleaning, and reassembly of the particle filter housing. Note: This procedure is not applicable to As/P systems, and as such, it should not be used with As/P systems.
74. Place the system in Idle by performing the Startup Following a Maintenance Shutdown procedure located in Operations, MaxBright GaN System Startup and K465i GaN System Startup section. Note: It is recommended that a thorough Reactor Chamber Bake-out is performed prior to utilizing the system for product growth runs after this procedure is performed.
Page 288
13. Place the system in Idle by performing the Startup Following a Maintenance Shutdown procedure located in Operations, K465i GaN System Startup section. Note: It is recommended that a thorough Reactor Chamber Bake-out is performed prior to utilizing the system for product growth runs after this procedure is performed.
In addition to the technician responsible for operating the system, a second site- qualified technician must be present in the building. Whenever maintenance or other system related functions are performed on Veeco TurboDisc systems, safety procedures must be followed, including the wearing of all required personnel protection equipment.
Although leaks in plumbing lines themselves are uncommon, it is still necessary to leak check all plumbing lines, weld points and strain points. Using the System Diagram provided by Veeco TurboDisc Operations, locate the leak detector port on the line that is being leak checked.
If a leak is still detected after performing steps a and b then replace the VCR fitting with a new one. Note that this will require welding, and either a qualified welder should perform the work, or call Veeco Compound Semiconductor at 1- 8TURBODISC.
1. Spray helium around every welded joint on the system. 2. If a leak is detected then remove the welded pieces from the system and have a qualified person re- weld where the suspected leak is or call Veeco TurboDisc Operations at 1-8TURBODISC. Procedure 5-33: Leak-Checking KF40/ISO 80/100 Lines 1.
P/N 1212831 Rev C Section 5.10. Gas/Hydrogen Monitoring Veeco's TurboDisc systems are equipped with a hydrogen detection apparatus which warns the operator of a hydrogen leak. Safety Precautions and Hazard Management In addition to the technician responsible for performing the maintenance, a second ...
Section 5.11. K465i GaN Decommissioning Instructions This section contains instructions on decommissioning (removing from use) a K465i GaN system. It includes system shutdown, cleaning, breakdown and preparation for storage and for shipment. This procedure can also be used for preparing the tool for shipment to another location.
site-qualified technician must be present in the FAB during the maintenance procedure. Whenever maintenance or other system related functions are performed on Veeco TurboDisc systems, safety procedures must be followed, including the wearing of all required personnel protection equipment.
K465i Operations and Maintenance P/N 1212831 Rev C CORE SYSTEM DECOMMISSIONING INSTRUCTIONS Note: The Decommissioning Instructions herein, covering parts-cleaning and shipping, will be supplemented with release details in Veeco Method Instructions. PROCEDURES IN DECOMMISSIONING The Decommissioning Instructions include: Cleaning a Soiled System ...
Page 337
P/N 1212831 Rev C Figure 5-162. Bubbler Jumper Procedure 5-37: Preliminary System Preparation 1. Shut the reactor down as described in the Maintenance Shutdown Procedure in the K465i GaN System Shutdown section. 2. Gather all necessary parts and tools. 3. Remove the flow flange following the Flow Flange Removal procedure in the K465i GaN Reactor Chamber Maintenance section.
Page 338
K465i Operations and Maintenance P/N 1212831 Rev C Figure 5-163. THA Interior and Robot Arms 13. Close the Transfer Hub Assembly following the following the K465i GaN Transfer Hub Assembly Chamber Maintenance procedure. Flushing the Water Lines 14. Turn off the heat exchangers and disconnect the power cords.
K465i Operations and Maintenance P/N 1212831 Rev C VEECO/FLUENS GLOVEBOX SETUP AND TEST Procedure 6-4: Glovebox Operation 1. Turn off pneumatics to the glove box pilot valves. 2. Check to make sure all of the cables and pneumatic lines are connected to their proper location.