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IMPORTANT FINAL PROCEDURE:
DO NOT POWER ON THE M2 UNTIL IT IS HOOKED TO
THE PC TO BE CALIBRATED
DO NOT CONNECT A SIGNAL OR CONNECT A LOAD
TO THE M2 UNTIL THE UNIT HAS BEEN
CALIBRATED. FAULURE TO DO SO WILL RESULT TO
DAMAGE.
S E R V IC ING P R E C A UT IONS
E lec tros tatic ally S ens itive (E S ) Devic es
S ome s emiconductor (s olid s tate) devices can be damaged
eas ily by s tatic electricity. S uch components commonly are
called E lectros tatically S ens itive (E S ) Devices . E xamples of
typical E S devices are integrated circuits and s ome field effect
trans is tors and s emiconductor chip components .
T he following techniques s hould be us ed to help reduce the
incidence of component damage caus ed by s tatic electricity.
1. Immediately before handling any s emiconductor component
or s emiconductor-equipped as s embly, drain off any electro-
s tatic charge on your body by touching a known earth
ground. Alternatively, obtain and wear a commercially avail-
able dis charging wris t s trap device, which s hould be
removed for potential s hock reas ons prior to applying power
to the unit under tes t.
2. After removing an electrical as s embly equipped with E S
devices , place the as s embly on a conductive s urface s uch
as aluminum foil, to prevent electros tatic charge buildup or
expos ure of the as s embly.
3. Us e only a grounded-tip s oldering iron to s older or uns older
E S devices .
4. Us e only an anti-s tatic s older removal device. S ome s older
removal devices not clas s ified as anti-s tatic can generate
electrical charges s ufficient to damage E S devices .
5. Do not us e freon-propelled chemicals . T hes e can generate
an electrical charge s ufficient to damage E S devices .
6. Do not remove a replacement E S device from its protective
package until immediately before you are ready to ins tall it.
(Mos t replacement E S devices are packaged with leads
electrically s horted together by conductive foam, aluminum
foil,or comparable conductive material).
7. Immediately before removing the protective material from
the leads of a replacement E S device, touch the protective
material to the chas s is or circuit as s embly into which the
device will be ins talled.
C aution: B e s ure no power is applied to the chas s is or cir-
cuit, and obs erve all other s afety precautions .
8. Minimize bodily motions when handling unpackaged replace-
ment E S devices . (Normally harmles s motion s uch as the
brus hing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate s tatic electricity s uf-
ficient to damage an E S device.)
EXPLODED VIEW
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