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Item Description
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Philips screwdriver
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Unfasten 2 screws to remove left and right bezels.
2.
Remove 6 screws to open the enclosure.
3.
Uninstall the CPU board.
4.
Remove 5 screws on the front bezel.
5.
Uninstall the 2 power supply units.
6.
Remove the back panel.
7.
Remove the main board.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Unfasten 2 screws to remove left and right bezels.
MF877-00
Template Revision A
Notes
HPE instructions for this template are available at
Tool Size (if
applicable)
#1
MF877-01
Quantity
of items
included
in product
0
Page 2
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