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8.1. Heat resistance characteristics
◆PCB A: θja=46.6°C/W, θjc=1°C/W(Junction – E-Pad)
PCB size: 110 mm x 80 mm x 1.6 mm
Number of layers: Single Layer (Cu 1 layer)
Layer thickness of Cu: 70μm
Layer area of Cu: 600mm
◆PCB B: θja=26.4°C/W, θjc=1°C/W(Junction – E-Pad)
PCB size: 114.3 mm x 76.2 mm x 1.6 mm (JDEC: Jesd51-7)
Number of layers: Multi Layer (Cu 4 layers)
Layer thickness of Cu: 35μm (1/4 layers), 70 μm (2/3 layers)
Layer area of Cu: 74 x 74 mm
Condition: Power consumption 1W
Ambient (environment) temperature 25°C
Windless
100
10
1
0.1
0.001
0.01
0.1
Figure 8.1 Heat resistance characteristics
2
Ａ基板
Ｂ基板
PCB A
PCB B
1
10
Time (sec)
2
FR-4 layer
FR-4 layer
FR-4 layer
*According to Jesd51-7
35 / 49
TB9051FTG
100
1000
10000
Ver.1.1 2019-03-14
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