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MDC901-EVKHB
Technical Manual
MDC901 200V GaN Gate Driver Half-Bridge Evaluation Board
Integrated High-Side and Low-Side GaN Gate Driver
MDC901-EVBHB Rev2021Jan5
Attention: Please refer to Evaluation Kit Important Notice on the page 20
For the current version of this Technical Manual and accompanying
product documentation, visit
Scan the QR code for a direct link to the latest MDC901 documentation.
MinDCet NV
mindcet.com
www.mindcet.com
Page 1
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Table of Contents
Related Manuals for Wurth Elektronik MDC901-EVKHB
Summary of Contents for Wurth Elektronik MDC901-EVKHB
- Page 1 MDC901-EVKHB Technical Manual MDC901 200V GaN Gate Driver Half-Bridge Evaluation Board Integrated High-Side and Low-Side GaN Gate Driver For the current version of this Technical Manual and accompanying product documentation, visit mindcet.com Scan the QR code for a direct link to the latest MDC901 documentation.
- Page 2 For safe and proper use, follow these instructions. Keep them for future reference. WARNING: ONLY qualified personnel* should handle this board! WARNING: Electrical Shock Hazard - Hazardous high voltage may be present on the board during the test and even brief contact during operation may result in severe injury or death.
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Page 3: Table Of Contents
Table of Contents Introduction ..............................4 Overview ..............................5 Board Block Diagram ..........................8 Board Handling Instructions & Quick Start ....................9 Dead Time Control Conditions ......................... 11 Temperature Measurements ........................13 EVB Operation Conditions ........................14 Performance Evaluation ........................... 16 Storage Conditions ........................... -
Page 4: Introduction
Figure 1: MDC901-EVBHB 100V Half-bridge GaN evaluation board, top view Evaluation Kit Contents To enable direct MDC901 evaluation, the evaluation kit contains the necessary hardware for out-of-the-box testing capability. The MDC901-EVKHB includes: Quantity Component Description 1 MDC901-EVBHB Half-bridge evaluation board Heatsink &... -
Page 5: Overview
Overview The evaluation board (EVB) is designed in a half bridge configuration for step-down conversion. One MinDCet MDC901 GaN gate driver is present driving two GaN Systems GS61008P 100V enhancement mode high mobility transistors (e-HEMT). Figure 2: EVB layout description based, labeled by key aspects The EVB is broken down into blocks for description purposes, as displayed in Figure 2. - Page 6 12V Fan Power Supply The VDRM MAGI³C Power Module from Würth Elektronik provides a regulated 12V output, suppling the fan socket as well as the MDC901 itself. For specifications and more information, refer to the most recent datasheet at https://www.we- online.de/powermodules Inductor &...
- Page 7 Digital dead-time generation tuning input for feed forward TgapOff_2 turn-off delay. Digital input for feedforward dead-time generation. Active ZVS_IN high. Digital dead-time generation tuning input for feed forward TgapOn_4 turn-on delay. Digital dead-time generation tuning input for feed forward TgapOn_3 turn-on delay.
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Page 8: Board Block Diagram
Other Board Features Test pin probe points are installed for Vbus, Vout, and GND for waveform and efficiency measurements. For higher power loss situations, there is a 30x30mm² heat sink and fan assembly with thermal interface material applied, which can be fastened to the back of the PCB using the integrated spring pin system. Further information on operating conditions for safe handling of the EVB can be found in EVB Operation Conditions. -
Page 9: Board Handling Instructions & Quick Start
Board Handling Instructions & Quick Start When operating the evaluation board for the first time, please follow the procedure to ensure safe handling and proper EVB usage. Before board operation, refer to the EVB Operation Conditions Section to determine whether the fan/heat sink assembly (hereby referred to as fan assembly) is required. - Page 10 3. Install the plastic spacer studs in each corner of the a. 4 cm studs on the PCB bottom side b. 2 cm studs on the top side 4. Connect the power cables: a. Ring terminals to the PCB using the included bolt + washer + nut (according to Figure 5) b.
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Page 11: Dead Time Control Conditions
Power Down & Disconnect Procedure 1. Slowly power down Vbus voltage back to zero and turn off 2. Shut down the PWM function generator 3. Wait at least 5 minutes (with fan on) or 10 minutes (without fan assembly installed) after operation for EVB to fully de-energize and cool down 4. - Page 12 Manual Dead time Selection CAUTION: Dead time must be monitored by an oscilloscope in manual dead time mode to avoid HS/LS overlap Four operating modes are available for MDC901 operation, defined by MHS_sel and MLS_sel state, described in the truth table in Table 1. Table 1: Truth table for mode selection mode synch/async...
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Page 13: Temperature Measurements
The input pins jumper positions for TgapOn<2:4>, and TgapOff<2:4> determine the respective total dead time according to the following equations: ������������ = 2.8���� + ������������2 + ������������3 + ������������4 �������������� = 2.8���� + ��������������2 + ��������������3 + ��������������4 Where Table 1Table 2 defines the amount of dead time for each pin input. Table 2: Dead time adjustment variable values Pin State TgapOn2 /TgapOff2... -
Page 14: Evb Operation Conditions
The gate driver IC temperature is calculated based on the measured voltage between output pin 1 and GND, according to: �� − 0.48 ����ℎ���� = + 25 [℃] 0.0016 EVB Operation Conditions Operating conditions are conditions under which operation of the EVB is intended to be functional. Safe usage: total power loss (Ploss) to prevent overheating and damage to EVB Pin=VBus * IBus ... - Page 15 Based on the ripple current and the graph in Figure 8, the AC losses can be determined. The DC losses are Joule losses, defined by �� = �� . �� ���� ���� ���� measured AC power loss of 1.4 µH WE 7443630140 1,E+05 1,E+06 1,E+07...
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Page 16: Performance Evaluation
Performance Evaluation Electrical &Thermal Results EVB performance was evaluated in a step-down conversion of 48 to 12 V application, sweeping over a switching frequency range from 300 to 700 kHz and an output current (Iout) from 0.5 A to 30 A, with the heatsink attached and fan turned on. -
Page 17: Storage Conditions
MDC901 Die Temperature The MDC901 die temperature can be monitored during efficiency measurements, as described in Temperature Measurements. Storage Conditions The EVB is best stored in the original packaging under room temperature with dry conditions. After testing and proper de-energizing/cool-down time, the EVB can be placed in the large compartment of the foam insert (the EVB spacer studs align with the holes in the foam to better secure the EVB during storage and transportation). -
Page 18: Appendix
Appendix EVB Schematic Bill of Materials Available upon request, please contact support@mindcet.com PCB Design / Gerber Files For assistance in accelerating the design-in phase, the EVB layout files are available upon request. For the most recent version, please contact support@mindcet.com MDC901-EVBHB Rev2021Jan5 MinDCet NV www.mindcet.com... -
Page 19: Cautions And Warnings
Cautions and Warnings The following conditions apply to all goods within the product series of MinDCet NV General: All recommendations according to the general technical usage and specifications of this guide have to be complied with. The usage and operation of the product within ambient conditions which probably alloy or harm the component surface has to be avoided. -
Page 20: Important Notice
Important Notice The Technical Manual is based on our knowledge and experience of typical requirements concerning these areas. It serves as general guidance and should not be construed as a commitment for the suitability for customer applications by MinDCet NV (hereafter referred to as MDC). The information in the Application Note is subject to change without notice. -
Page 21: Contact Information
health it must be ensured by most advanced technological aid of suitable design of the customer application that no injury or damage is caused to third parties in the event of malfunction or failure of an electronic component. 3. Best Care and Attention Any product-specific notes, warnings and cautions must be strictly observed.
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