HP Mini 1000 Maintenance And Service Manual page 60

2. Remove the heat sink assembly (2).
NOTE:
assembly and system board components, it may be necessary to move the heat sink assembly
from side to side to detach the assembly.
NOTE:
assembly and the system board each time the heat sink assembly is removed. Thermal paste is
used on the processor (1), the heat sink section (2) that services the processor, the Northbridge
chip (3), and the heat sink section (4) that services the Northbridge chip. Replacement thermal
material is included with all heat sink assembly and system board spare part kits.
Reverse this procedure to install the heat sink assembly.
52 Chapter 4 Removal and replacement procedures
Due to the adhesive quality of the thermal material located between the heat sink
The thermal material must be thoroughly cleaned from the surfaces of the heat sink