HP G60-231 Maintenance And Service Manual page 84

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The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink and the system board
components each time the fan/heat sink is removed. Thermal grease is located on the section of the fan/heat sink
1 that services the processor 2. Thermal pads are located on the section of the fan/heat sink 3 that services the
Northbridge chip 4. Replacement thermal grease and pads are included with all system board, fan/heat sink
assembly, and processor spare part kits.
The following illustration shows the replacement thermal material locations for computer models equipped with
graphics subsystems with UMA memory.
The following illustration shows the replacement thermal material locations for computer models equipped with
graphics subsystems with discrete memory.
Reverse this procedure to install the fan/heat sink assembly.
Removal and replacement procedures 4–43