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SPP-114
5-4. PRINTED WIRING BOARD — BASE UNIT SECTION —
• Semiconductor
Location
Ref. No.
Location
D1
B-2
D51
G-2
D101
D-8
D201
B-9
D203
B-8
D204
B-8
D205
B-7
D301
C-7
D401
B-5
D501
G-7
IC101
E-4
IC301
G-10
IC501
F-8
PH201
C-8
Q51
E-1
Q52
F-2
Q54
E-2
Q201
B-6
Q202
D-6
Q301
D-8
Q302
F-10
Q401
A-2
Q402
B-4
Q403
B-4
Note on Printed Wiring Boards:
• X : parts extracted from the component side.
•
: parts mounted on the conductor side.
p
•
¢
: internal component.
• b : Pattern from the side which enables seeing.
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1
/
W or less unless otherwise
4
specified.
•
: internal component.
¢
• 2 : nonflammable resistor.
• C : panel designation.
• U : B+ Line.
20
• H : adjustment for repair.
• Power voltage is dc 9 V and fed with regulated dc power
supply from external power voltage jack.
• Power voltage is dc 12 V and fed with regulated dc power
supply from MJ201 with 100 Ω in series.
• Voltage is dc with respect to ground under no-signal
condition.
no mark : TALK
∗
: Impossible to measure
20
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Signal path.
N
: TX (To Tel Line)
O
: RX (From Tel Line)
P
: bell
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