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SERVICE MANUAL
Ver 1.0 1999. 10
MICROFILM
SPECIFICATIONS
General
Frequency control
Crystal-controlled PLL
Operation mode
FM, duplex
Operation channel
25 channels
Supplied accessories
AC power adaptor AC-T56 (1)
Telephone line cord (1)
Rechargeable battery pack BP-T16 (1)
Screws (2)
Directories (2 sheets)
Handset
Power source
Rechargeable battery pack BP-T16
Battery life
Standby: Approx. 14 days
Talk:
Approx. 6 hours
Dimensions
Approx. 2
3/8
excluded (approx. 58 × 194 × 47 mm)
Antenna: Approx. 4
Mass
Approx. 7.8 oz (approx. 220 g), battery included
Base unit
Power source
DC 9V from AC power adaptor
Battery charging time
Approx. 12 hours
Dimensions
Approx. 5
1/4
excluded (approx. 132 × 56 × 220 mm)
Antenna: Approx. 12
Mass
Approx. 11 oz (approx. 310 g)
Design and specifications are subject to change without notice.
– 1 –
SPP-111
× 7
× 1
inches (w/h/d), antenna
3/4
7/8
inches (approx. 110 mm)
3/8
× 2
× 8
inches (w/h/d), antenna
1/4
3/4
inches (approx. 310 mm)
1/4
CORDLESS TELEPHONE
E Model

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   Summary of Contents for Sony SPP-111

  • Page 1 SPP-111 SERVICE MANUAL E Model Ver 1.0 1999. 10 SPECIFICATIONS General Frequency control Crystal-controlled PLL Operation mode FM, duplex Operation channel 25 channels Supplied accessories AC power adaptor AC-T56 (1) Telephone line cord (1) Rechargeable battery pack BP-T16 (1) Screws (2)
  • Page 2: Table Of Contents

    COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
  • Page 3: General

    SECTION 1 GENERAL This section is extracted from instruction manual. – 3 –...
  • Page 4 – 4 –...
  • Page 5 – 5 –...
  • Page 6: Disassembly

    SECTION 2 DISASSEMBLY Note : Follow the disassembly procedure in the numerical order given. 2-1. CABINET (LOWER) (BASE UNIT) 1 P 3x10 2 P 3x10 4 cabinet (lower) 3 connector (CN301) 2-2. CABINET (REAR) (HANDSET) 4 claw 3 claws 1 battery case lid assy 2 BTP 2.6x10 5 cabinet (rear) –...
  • Page 7: Test Mode

    SECTION 3 TEST MODE BASE UNIT SECTION MACHINE TEST MODE Set the Test Mode: 1. With one of the CH setting terminals in “H” input state, cause MANUAL TEST MODE Reset of Power ON. Equipment enters machine test mode. Set the Test Mode: 2.
  • Page 8 Channel Setting: During startup in machine test mode, make the following channel settings by loading the terminal input data. Pin No. TX frequency RX frequency (MHz) (MHz) Channel (TP61) (TP62) (TP63) (TP64) 43.720 48.760 43.740 48.840 43.820 48.860 43.840 48.920 43.920 49.020 43.960...
  • Page 9: Handset Section

    HANDSET SECTION MACHINE TEST MODE Set the Test Mode: 1. When power on reset is applied while a “H” (high) is input the MANUAL TEST MODE TEST SW (TP43) terminal (IC501 $º pin), the RING (Level Set the Test Mode: H, 500 msec) sounds.
  • Page 10 Channel Setting: During startup in machine test mode, make the following channel settings by loading the terminal input data. Pin No. TX frequency RX frequency ROW5 ROW4 ROW3 ROW2 ROW1 (MHz) (MHz) Channel (TP13) (TP14) (TP15) (TP16) (TP17) 48.760 43.720 48.840 43.740 48.860...
  • Page 11 Key Processing (Setting the Manual Test Mode) : 1. (Upper position) (Lower position) Set with #. 2. 3X# can be substituted with X . Upper position Lower position QUIT 10 ch 20 ch Batt Alarm KEY TEST 1 ch 11 ch 21 ch CHARGE DET 2 ch...
  • Page 12: Electrical Adjustments

    SECTION 4 ELECTRICAL ADJUSTMENTS BASE UNIT SECTION RX SECTION ADJUSTMENT RX LEVEL Adjustment Note: Note: • Apply 9V dc from regurated DC power supply. • Perform the adjustment at TEST3CH (28CH : 49.910 MHz) as a • Perform the adjustment at TEST3CH (28CH : 49.910 MHz) as a rule.
  • Page 13 Adjustment Location : – base main board (component side) – L101 FL101 RV101 – base main board (conductor side) – TP104 TP19 TP105 TP23 IC101 IC501 – 13 –...
  • Page 14: Handset Section

    HANDSET SECTION RX SECTION ADJUSTMENT RX LEVEL Adjustment Note: Note: • Apply 3.6 V dc from regurated DC power supply. • Perform the adjustment at TEST1CH (26CH : 43.780 MHz) as a • Perform the adjustment at TEST1CH (26CH : 43.780 MHz) as a rule.
  • Page 15 Adjustment Location : – hand main board (side A) – RV101 L102 FL101 – hand main board (side B) – TP27 TP26 IC501 IC101 TP30 – 15 –...
  • Page 16: Diagrams

    SECTION 5 DIAGRAMS 5-1. IC PIN DESCRIPTIONS • IC501 SB662104A-4L43-TLM (SYSTEM CONTROL) (BASE UNIT) Pin No. Pin Name Pin Description Strobe signal output to PLL. DATA Serial data output to PLL. Serial clock output to PLL. RX-DATA RX data input SIG-IN RSSI/PLL-LOCK signal input (L: RSSI, H: PLL-LOCK) H-MUTE...
  • Page 17 • IC501 SH66356C-4L44 (SYSTEM CONTROL) (HANDSET) Pin No. Pin Name Pin Description TEST CH Test mode channel control output (L: Active) KEY LED Key LED ON/OFF control output (L: ON) (Fixed at “H” in this set.) SIG-IN RSSI/PLL-LOCK signal input (L: RSSI, H: PLL-LOCK) PLL-STB Strobe signal output to PLL.
  • Page 18: Block Diagram -base Unit Section

    SPP-111 5-2. BLOCK DIAGRAM — BASE UNIT SECTION — ANT1 TELESCOPIC ANTENNA D101 B+ (+5.2V) FL101 460kHz MJ201 MIX, IF AMP, DET RX LEVEL LINE EXPANDER IC101 (1/3) IC101 (2/3) D205 BPF1 CF101 RECT 46MHz 460kHz B+ (+5.2V) T201 RECEIVER...
  • Page 19: Block Diagram -handset Section

    SPP-111 5-3. BLOCK DIAGRAM — HANDSET SECTION — ANT2 B+ (+3.6V) HELICAL ANTENNA S101 FL101 460kHz MIX, IF AMP, DET RX LEVEL EXPANDER IC101 (1/3) IC101 (2/3) RECEIVER BPF1 CF101 49MHz 460kHz RECE-IN QUAD SPEAKER – CF102 E-MUTE 10.68MHz IF-IN...
  • Page 20: Printed Wiring Board -base Unit Section

    SPP-111 5-4. PRINTED WIRING BOARD — BASE UNIT SECTION — • Semiconductor Location Ref. No. Location D101 D201 D203 D204 D205 D206 D207 D208 D301 D401 D501 IC101 IC301 G-10 IC302 IC501 PH201 PH202 Q201 Q202 Q203 Q302 F-10 Q401...
  • Page 21: Schematic Diagram -base Unit Section

    SPP-111 5-5. SCHEMATIC DIAGRAM — BASE UNIT SECTION — 2SC1623-L5L6 – 25 – – 26 –...
  • Page 22: Printed Wiring Board -handset Section

    SPP-111 5-6. PRINTED WIRING BOARD — HANDSET SECTION — WXYZ OPER PQRS • Semiconductor Location Ref. No. Location Ref. No. Location IC501 B-10 D202 B-14 D301 A-14 Note: D501 • X : parts extracted from the component side. Caution: D502 A-10 •...
  • Page 23 SPP-111 5-7. SCHEMATIC DIAGRAM — HANDSET SECTION — • Refer to page 24 for Note. – 29 – – 30 –...
  • Page 24: Exploded Views

    SECTION 6 EXPLODED VIEWS Note on Schematic Diagram: NOTE: • All capacitors are in µF unless otherwise noted. pF: µµF • The mechanical parts with no reference • -XX and -X mean standardized parts, so • Accessories and packing materials and 50 WV or less are not indicated except for electrolytics number in the exploded views are not supplied.
  • Page 25: Handset Section

    6-2. HANDSET SECTION MIC1 ANT2 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark X-3377-828-1 LID ASSY (G), BATTERY CASE * 58 3-033-764-01 CUSHION (BUZZER) 3-038-923-01 CABINET (REAR) 1-771-708-11 SWITCH, RUBBER KEY (HAND) * 53 A-3622-319-A HAND MAIN BOARD, COMPLETE 3-371-005-01 GASKET (RECEIVER) (TWN) 3-939-070-01 TERMINAL, ANTENNA 3-038-925-01 CABINET (FRONT)
  • Page 26: Electrical Parts List

    SECTION 7 BASE MAIN ELECTRICAL PARTS LIST NOTE: • Due to standardization, replacements in • Items marked “*” are not stocked since The components identified by the parts list may be different from the they are seldom required for routine service. mark ! or dotted line with mark parts specified in the diagrams or the Some delay should be anticipated...
  • Page 27 BASE MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark < FILTER > JR20 1-216-295-00 SHORT JR21 1-216-295-00 SHORT CF101 1-767-418-11 FILTER, CERAMIC JR22 1-216-295-00 SHORT CF102 1-577-070-11 FILTER, CERAMIC JR24 1-216-296-00 SHORT JR205 1-216-295-00 SHORT <...
  • Page 28 BASE MAIN HAND MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R104 1-216-105-11 RES,CHIP 220K 1/10W R508 1-216-097-11 RES,CHIP 100K 1/10W R105 1-216-107-00 METAL CHIP 270K 1/10W R509 1-216-121-11 RES,CHIP 1/10W R106 1-216-095-00 METAL CHIP 1/10W R510 1-216-246-00 RES,CHIP...
  • Page 29 HAND MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 1-163-009-11 CERAMIC CHIP 0.001uF C149 1-163-021-11 CERAMIC CHIP 0.01uF 1-163-243-11 CERAMIC CHIP 47PF C201 1-163-035-00 CERAMIC CHIP 0.047uF 1-163-033-11 CERAMIC CHIP 0.022uF C202 1-164-336-11 CERAMIC CHIP 0.33uF 1-163-235-11 CERAMIC CHIP 22PF...
  • Page 30 HAND MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark JR114 1-216-296-00 SHORT 1-216-069-00 METAL CHIP 6.8K 1/10W JR115 1-216-296-00 SHORT 1-216-107-00 METAL CHIP 270K 1/10W JR117 1-216-296-00 SHORT 1-216-097-11 RES,CHIP 100K 1/10W JR120 1-216-296-00 SHORT 1-216-057-00 METAL CHIP 2.2K 1/10W...
  • Page 31 HAND MAIN Ref. No. Part No. Description Remark R520 1-216-121-11 RES,CHIP 1/10W R521 1-216-097-11 RES,CHIP 100K 1/10W R522 1-216-129-00 METAL CHIP 2.2M 1/10W R532 1-216-073-00 METAL CHIP 1/10W R533 1-216-097-11 RES,CHIP 100K 1/10W R534 1-216-097-11 RES,CHIP 100K 1/10W R541 1-216-117-00 METAL CHIP 680K 1/10W R555...
  • Page 32 SPP-111 Sony Corporation 99J0420-1 9-926-586-31 Personal Audio Division Company Printed in Japan ©1999. 10 – 40 – Published by General Engineering Dept.

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