1. Manuals
  2. Brands
  3. Sony Manuals
  4. Cordless Telephone
  5. SPP-ID975 - Cordless Telephone
  6. Service manual

Sony SPP-ID975 Service Manual

Hide thumbs Also See for SPP-ID975:
Table of Contents

Advertisement

Quick Links

Download this manual
SPP-ID975/ID976
SERVICE MANUAL
Ver 1.0 1999. 11
General
Frequency band (SPP-ID975)
902 – 928 MHz
Frequency band (SPP-ID976)
923.1 – 927.75 MHz
Base phone : 18 µW
Handset
: 73 µW
Operating channel
30 channels
Dial signal
Tone, 10 PPS (pulse) selectable
Supplied accessories
AC power adaptor AC-T122 (1)
Telephone line cords (2)
Wall bracket for base phone (1)
Rechargeable battery pack BP-T23 (1)
Handset
Power source
Rechargeable battery pack BP-T23
Battery charging time
Approx. 12 hours
Battery life
Standby : Approx. 7 days
Talk
: Approx. 6 hours
Dimensions
Approx. 58 × 177 × 46 mm (w/h/d),
antenna excluded
× 7 × 1
(approx. 2
inches)
3/8
13/16
Antenna: Approx. 72 mm
(approx. 2
inches)
7/8
Mass
Approx. 270 g
(approx. 9.5 oz), battery included
MICROFILM
Photo: SPP-ID975
SPECIFICATIONS
Base phone
Power source
DC 9V from AC power adaptor
AC-T122
Battery charging time
Approx. 24 hours
Dimensions
Approx. 166 × 63 × 225 mm (w/h/d),
antenna excluded
× 2
(approx. 6
5/8
Antenna: Approx. 120 mm
(approx. 4
inches)
3/4
Mass
Approx. 595 g
(approx. 1 lb 9 oz), wall bracket excluded
Design and specifications are subject to
change without notice.
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
– 1 –
US Model
Canadian Model
× 8
inches)
1/2
7/8
CORDLESS TELEPHONE
SPP-ID975
SPP-ID976

Advertisement

Table of Contents
loading

Related Manuals for Sony SPP-ID975

Summary of Contents for Sony SPP-ID975

  • Page 1 SPP-ID975 Ver 1.0 1999. 11 Canadian Model SPP-ID976 Photo: SPP-ID975 SPECIFICATIONS Base phone General Frequency band (SPP-ID975) Power source 902 – 928 MHz DC 9V from AC power adaptor Frequency band (SPP-ID976) AC-T122 923.1 – 927.75 MHz Battery charging time Base phone : 18 µW...

  • Page 2: Table Of Contents

    Note for Replacement of the ASIC Board TABLE OF CONTENTS The ID is written in the ASIC board. When replacing the ASIC board, the U3003 on BASE MAIN board 1. GENERAL and U1001 on HAND MAIN board should be replaced together as Read This First ................
  • Page 3 SECTION 1 GENERAL This section is extracted from SPP-ID975’s instruction manual. – 3 –...
  • Page 4 – 4 –...
  • Page 5 – 5 –...
  • Page 6 – 6 –...
  • Page 7 – 7 –...
  • Page 8 – 8 –...
  • Page 9 – 9 –...
  • Page 10 – 10 –...
  • Page 11 – 11 –...
  • Page 12 – 12 –...
  • Page 13 – 13 –...
  • Page 14 – 14 –...

  • Page 15: Disassembly

    SECTION 2 DISASSEMBLY • The equipment can be removed using the following procedure. HANDSET CASE (REAR) RF UNIT (HS), HAND MAIN BOARD BASE PHONE BASE (BOTTOM) BASE MAIN BOARD RF UNIT (BU) BASE KEY BOARD Note : Follow the disassembly procedure in the numerical order given. 2-1.

  • Page 16: Base (Bottom)

    2-3. BASE (BOTTOM) 2 BTP 3x12 6 base (bottom) 3 BTP 3x12 1 BTP 3x12 2-4. BASE MAIN BOARD 1 screws (3x30) 3 BTP 3x12 4 Removal the solders. 9 BASE MAIN board 2 BTP 3x12 5 Removal the solders. battery terminal (BU) 7 Removal the solders.

  • Page 17: Rf Unit (Bu)

    2-5. RF UNIT (BU) 1 BTP 3x12 3 B 2x8 2 BTP 3x12 4 RF unit (BU) 2-6. BASE KEY BOARD 2 BTP 3x12 1 BTP 3x12 3 speaker holder 7 BASE KEY board 4 B 2x6 5 B 2x6 6 Removal the solders.

  • Page 18: Electrical Adjustments

    SECTION 3 ELECTRICAL ADJUSTMENTS 3-1. HANDSET 1. Test Mode Entry— Press “PGM” key and enter “ TEST” on keypad. Alternative entry— Write 99h into LSB of location 9 in EEPROM. Exit— Press on “OFF” key. LCD test— Press the “7” key. Toggle TX power—...

  • Page 19: Base Phone

    3-2. BASE PHONE 1. Test Mode Entry— Simultaneously press the “INTERCOM” key and toggle the “DIAL MODE” switch. When in test mode, the “LINE” and “CHARGE” LEDs will be light on. Alternative entry— Write 99h into LSB of location 9 in EEPROM. Exit—...

  • Page 20: Diagrams

    SPP-ID975/ID976 SECTION 4 DIAGRAMS 4-1. BLOCK DIAGRAM — BASE PHONE SECTION — ANT3001 TELESCOPIC ANTENNA RF UNIT (BU) SYSTEM CONTROL U3003 D1007-1009 T1001 HOOK DET U1002 RX AUDIO DSIN J1008 TXDATA TX DATA LINE PLL REF PLL REF RSSI APIN2...

  • Page 21: Block Diagram -Handset Section

    SPP-ID975/ID976 4-2. BLOCK DIAGRAM — HANDSET SECTION — ANT1001 HELICAL ANTENNA SYSTEM CONTROL IC1001 RF UNIT (HS) PLL REF 64 PLL REF DSIN RX AUDIO U1005 TX DATA TXDATA SPEAKER RSSI ADIN2 PLL EN GPIO2/MON2 SER DATA OUT U1002 SER CLK...

  • Page 22: Schematic Diagram -Base Main Section (1/2)

    SPP-ID975/ID976 4-3. SCHEMATIC DIAGRAM — BASE MAIN SECTION (1/2) — THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. (In addition to this, the necessary note is printed in each block.) For schematic diagrams • All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.

  • Page 23: Schematic Diagram -Base Main Section (2/2)

    SPP-ID975/ID976 4-4. SCHEMATIC DIAGRAM — BASE MAIN SECTION (2/2) — • Refer to page 41 for IC Block Diagrams. RF UNIT (BU) – 27 – – 28 –...

  • Page 24: Printed Wiring Board -Base Main Section

    SPP-ID975/ID976 4-5. PRINTED WIRING BOARD — BASE MAIN SECTION — • Semiconductor Location (side A) Ref. No. Location D1001 D1011 D1012 D1015 D1016 D3001 Q1006 Q1008 Q3001 Q3002 Q3003 Q3005 U1003 U3001 U3003 U3004 U3005 U3007 U3008 – 29 –...
  • Page 25 SPP-ID975/ID976 • Semiconductor Location (side B) Ref. No. Location D1006 D1007 D1008 D1009 D1010 Q1001 Q1007 U1001 U1002 (Page 34) – 31 – – 32 –...

  • Page 26: Printed Wiring Board -Base Key Section

    SPP-ID975/ID976 4-6. PRINTED WIRING BOARD — BASE KEY SECTION — (Page 31) • Semiconductor Location Ref. No. Location Ref. No. Location – 33 – – 34 –...

  • Page 27: Schematic Diagram -Base Key Section

    SPP-ID975/ID976 4-7. SCHEMATIC DIAGRAM — BASE KEY SECTION — – 35 – – 36 –...

  • Page 28: Printed Wiring Board -Hand Main Section

    SPP-ID975/ID976 4-8. PRINTED WIRING BOARD — HAND MAIN SECTION — • Semiconductor Location Ref. No. Location D1001 D1002 D1003 D1004 D1006 (D1009) (D1011) (D1017) (D1019) D1020 <D1023> A-2 <D1024> B-2 <D1025> B-2 <D1026> B-2 <D1027> A-2 <D1028> B-2 D1030 D1031 <D1032>...

  • Page 29: Schematic Diagram -Hand Main Section

    SPP-ID975/ID976 4-9. SCHEMATIC DIAGRAM — HAND MAIN SECTION — • Refer to page 41 for IC Block Diagrams. – 39 – – 40 –...

  • Page 30: Exploded Views

    SECTION 5 EXPLODED VIEWS NOTE: • IC Block Diagrams U3001 MC74HC595AF • The mechanical parts with no reference • -XX and -X mean standardized parts, so • Accessories and packing materials are number in the exploded views are not supplied. they may have some difference from the given in the last of this parts list.

  • Page 31: Base Phone Section

    5-2. BASE PHONE SECTION ANT3001 U3006 LCD1 J1002, 1005 J1003, 1004 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark * 51 A-3672-878-A BASE MAIN BOARD, COMPLETE 4-356-741-21 SCREW, TAPPING (BIND 2X8) 7-685-548-19 SCREW +BTP 3X12 TYPE2 N-S 3-038-069-01 BASE (BOTTOM) 3-044-144-01 TERMINAL BOARD, ANTENNA 3-041-534-01 FOOT, RUBBER...

  • Page 32: Electrical Parts List

    BASE KEY SECTION 6 ELECTRICAL PARTS LIST BASE MAIN NOTE: • Due to standardization, replacements in • Items marked “*” are not stocked since The components identified by mark 0 or dotted line with mark the parts list may be different from the they are seldom required for routine service.
  • Page 33 BASE MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C3025 1-107-826-11 CERAMIC CHIP 0.1uF < JACK > C3026 1-107-826-11 CERAMIC CHIP 0.1uF C3027 1-126-961-11 ELECT 2.2uF J1001 1-580-727-11 JACK (DC IN 9V) C3028 1-165-176-11 CERAMIC CHIP 0.047uF J1008 1-565-999-11 JACK, MODULAR 2P (LINE)
  • Page 34 BASE MAIN HAND MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R1045 1-219-570-11 METAL CHIP 1/16W R3058 1-216-848-11 METAL CHIP 180K 1/16W R1046 1-216-857-11 METAL CHIP 1/16W R3059 1-216-848-11 METAL CHIP 180K 1/16W R1047 1-216-857-11 METAL CHIP 1/16W R3060 1-216-839-11 METAL CHIP...
  • Page 35 HAND MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C1015 1-107-826-11 CERAMIC CHIP 0.1uF < TRANSISTOR > C1016 1-162-919-11 CERAMIC CHIP 22PF C1017 1-164-227-11 CERAMIC CHIP 0.022uF Q1002 8-729-026-07 TRANSISTOR MMBT3906LT1 C1018 1-162-918-11 CERAMIC CHIP 18PF Q1004 8-729-922-00 TRANSISTOR MMST2907A...
  • Page 36 SPP-ID975/ID976 HAND MAIN Ref. No. Part No. Description Remark R1071 1-216-852-11 METAL CHIP 390K 1/16W R1073 1-220-151-11 RES,CHIP 1/16W R1076 1-216-845-11 METAL CHIP 100K 1/16W R1079 1-216-864-11 METAL CHIP 1/16W R1083 1-216-849-11 METAL CHIP 220K 1/16W R1084 1-216-864-11 METAL CHIP...

This manual is also suitable for:

Spp-id976

Table of Contents