Before You Get Started What’s Included The ACB-III is shipped with the following items. If any of these items are missing or damaged, contact the supplier. • ACB-III Serial Interface Adapter • Channel B Interface Cable Advisory Conventions Warning The highest level of importance used to stress a condition where damage could result to the product, or the user could suffer serious injury.
The ACB-III contains several jumper straps which must be set for proper operation. Address Selection The ACB-III occupies 8 consecutive I/O locations. A DIP-switch (SW2) is used to set the base address for these locations. The ACB-III can reside in any I/O location between 100 and 3F8 Hex. Be careful when selecting the base address as some selections conflict with existing PC ports.
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Where "Base" is the selected base address. IRQ Selection (Header E8) The ACB-III has an interrupt selection jumper which should be set prior to use if an interrupt is required by your application software. Consult the user manual for the application software being used to determine the proper setting.
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Card Setup, Continued DMA Options Headers E4 and E5 select the Direct Memory Access (DMA) mode of operation for the ACB-III. Channel A of the SCC can operate in either half-duplex or full duplex DMA mode. Full duplex DMA can transmit and receive data simultaneously.
Installation Hardware Installation The ACB-III can be installed in any of the PC expansion slots. The ACB-III contains several jumper straps for each port which must be set for proper operation. Do not install the Adapter in the machine until the software has been fully installed.
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The SeaMAC software for the ACB-III is available upon request. For additional software support, please call Sealevel Systems’ Technical Support, (864) 843-4343. Our technical support is free and available from 8:00AM-5:00PM Eastern Time, Monday through Friday. For email support contact: support@sealevel.com.
Control/Status Port The ACB-III occupies eight Input/Output (I/O) addresses. The first four are used by the SCC chip, while the fifth address (Base+4) is the address of the on-board Control/Status Port. This port is used to set the Data Terminal Ready (DTR) signal, to enable or disable DMA under program control, and to monitor the Data Set Ready (DSR) input signals from the modem.
Non-Condensing Non-Condensing Manufacturing All Sealevel Systems Printed Circuit boards are built to UL 94V0 rating and are 100% electrically tested. These printed circuit boards are solder mask over bare copper or solder mask over tin nickel. Power Consumption Supply line...
No two adapters can occupy the same I/O address. 3. Make sure the Sealevel Systems adapter is using a unique IRQ. The IRQ is typically selected via an on-board header block. Refer to the section on Card Setup for help in choosing an I/O address and IRQ.
If possible, please have the adapter installed in a computer ready to run diagnostics. Sealevel Systems provides an FAQ section on its web site. Please refer to this to answer many common questions. This section can be found at http://www.sealevel.com/faq.asp.
I/O. In order to provide a means for higher rate data transfers, a special function called Direct Memory Access (DMA) was built into the original IBM PC. The DMA function allows the ACB-III (or any other DMA compatible interface) to read or write data to or from memory without using the Microprocessor.
ACB family. The ACB Resource Kit provides a brief overview of the ACB product line. Both of these kits are available at your request. For additional information, please contact Sealevel Systems, Inc. Technical Support for assistance: Available Monday –...
Sealevel's commitment to providing the best I/O solutions is reflected in the Lifetime Warranty that is standard on all Sealevel manufactured I/O products. We are able to offer this warranty due to our control of manufacturing quality and the historically high reliability of our products in the field. Sealevel products are designed and manufactured at its Liberty, South Carolina facility, allowing direct control over product development, production, burn-in and testing.
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