Introduction - Beta Layout Reflow Instruction Manual

Instruction Manual
Reflow-Controller

3. Introduction

The Reflow Oven CONTROLLER regulates the Reflow-Kit oven. In order to
achieve an optimal soldering result, determined times and temperatures must be
kept when soldering SMD components with flux.
The Reflow-Kit CONTROLLER regulates your oven in such a way that the times
and temperatures are adhered to and an optimal soldering result can be
achieved.
The boards and components are slowly heated in a preheating phase.
Thus mechanical stresses in the board and in the components are avoided.
After the preliminary heating the temperature is increased to just under the
soldering temperature. This allows the volatile components of the flux to escape,
avoiding blistering.
Heat then increases up to soldering temperature. The flux will become liquid and
the componenets will form a connection to the board. The soldering temperature
is accurately adhered to during the soldering phase, so that no damages arise
through overheating.
The CONTROLLER will beep to signal the conclusion of the soldering phase. The
finished soldered board can now be taken from the oven.
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