Module Is Easy To Damage; Ber(Bit Error Rate) Is High; Production Guidance; Reflow Soldering Temperature - Ebyte E72-2G4M05S1G User Manual

Chengdu Ebyte Electronic Technology Co.,Ltd.

5.2 Module is easy to damage

Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module;
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Please check the stability of power source, the voltage cannot fluctuate too much;
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Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic

susceptibility;
Please ensure the humidity is within limited range, some parts are sensitive to humidity;
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Please avoid using modules under too high or too low temperature.
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5.3 BER(Bit Error Rate) is high

There are co-channel signal interference nearby, please be away from interference sources or modify
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frequency and channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable;
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The extension line and feeder quality are poor or too long, so the bit error rate is high.
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6 Production guidance

6.1 Reflow soldering temperature

Profile Feature
Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Peak temperature（Tp）
Aveage ramp-down rate（Tp to Tsmax）
Time 25℃ to peak temperature
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Curve characteristics
Solder paste
Min preheating temp.
Mx preheating temp.
Preheating time
Average ramp-up rate
Liquid phase temp.
Time below liquid phase line
Peak temp.
Aveage ramp-down rate
Time to peak temperature for
25℃
E72-2G4M05S1G User Manual
Sn-Pb Assembly Pb-Free Assembly
Sn63/Pb37 Sn96.5/Ag3/Cu0.5
100℃
150℃
60-120 sec
3℃/second max 3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max 6℃/second max
6 minutes max 8 minutes max
150℃
200℃
60-120 sec
217℃
30-90 sec
230-250℃
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