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2) FPC board design
(1)Positions of connectors on the FPC
The FPC board is made by laminating a polyimide layer, copper foil, and adhesive
layers. Since each material has slightly different heat-shrinkable properties,
warpage may occur typically due the reflow heat in the following cases. This may
cause poor soldering. Make sure to arrange the board in a direction that minimizes
warpage.
Since the FPC is soft, it is
difficult to keep it flat.
■ Example of the Assist carrier (ShinEtsu Polymer)
Workpiece
Elastomer
(Weak adhesive layer)
Workpiece (FPC, etc.)
Panasonic Corporation
industrial.panasonic.com/ac/e/
Operation manual for Narrow-pitch connectors A35US
(FPC board, etc.)
Elastomer
(Strong adhesive layer)
Substrate
Assist carrier
Layout pin
In case of a one-sided FPC board, warpage is
more likely to occur if a pattern is laid in a line,
or if the copper foil is applied over the entire
FPC board for noise-prevention purposes.
To keep the FPC board flat during
mounting, we recommend the use of a
"Sticky transfer jig" for the wiring board
mounting process.
●Typical transfer jigs for the board
mounting process
- Magic resin (Daisho Denshi)
- Keiju board (Mitsubishi Resin)
- Assist carrier (ShinEtsu Polymer)
Removal pin
STEP 1:
Provisional fixing of workpiece
©
- 9 -
Panasonic Corporation 2015
STEP 3:
Removal of
workpiece
STEP 2:
Mounting complete
ACCTF14E-3
201509
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