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NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board each time the heat sink is removed.
Thermal material is used on the processor (1) and the heat sink section (2) that services it. Thermal material is
also used on the graphics subsystem chip (3) and the heat sink section (4) that services it. The following
illustration shows the thermal material locations on a computer model equipped with a graphics subsystem with
discrete memory.
Thermal material is used on the processor (1) and the heat sink section (2) that services it. The following
illustration shows the thermal material locations on a computer model equipped with a graphics subsystem with
UMA memory.
Reverse this procedure to install the heat sink.
TouchPad cable
Description
TouchPad cable (includes double-sided adhesive)
Spare part number
856203-001
Component replacement procedures
51
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