Hardware Configuration - Samsung CLP-775ND Series Service Manual

2.2.5. Hardware Configuration

The CLP-775ND Electrical Circuit System consists of the following:
•
Main board
•
SMPS board
•
HVPS board and HVPS sub board
•
Fuser Drive board
•
OPE board
CLP-775ND Block Diagram
ADDR
MAIN P BA
DATA
DDR2
OP TION 32b it
SODIMM
MODULE
S ATA
S C L0_C 4
S DA0_C 4
S ATA I/F
EEP ROM
WLAN
M24512
US B
EDI
HUB
DEVICE DEVICE
US B US B
P arallel p wr
GIGA BIT
RTL8211D
C4 Lp e c 3
VDDQ VTT
1.8.V 0.9V
1.1V 1.8V
DC Co n ve rte r
PWM Co n '
POWER
CORD
Copyright© 1995-2016 SAMSUNG. All rights reserved.
n F _R ES ET
RES ET IC
12Mh z
SSCG
n R ES ET
Fla s h Me m ory
32M
MCLK UCLK
Ch o ru s
4
C LK_LP EC
3
US B Hos t
SATA_CLK RTC CLK
SSCG
32.768Kh z
15Mh z
Sys te m
3.3V
5V
n P OWER _OF F
1W MICOM
Re g u la to r
n KEY_P OWER _S W
5V_SMPS 24V1/24V2/24V3
SMPS TYPE5 (STAGE3)
FUSER La m p Co n tro l
S CF UNIT
S C F _R XD
(OP TION)
S C F _TXD
12Mh z
VCLK
S e ns or-Ana log
-TEMP_IN
M
-Humid ity/TEMP_OUT
U
LP EC3
X
AS IC
En g in e
Co n tro l
5V
5VS
24V1
24VS1
S C L_DEV
n S LEEP _24V_OF F
S DA_DEV
F US ER C ONTR OL
AC
2. Product spec and feature
LS U
-2 Po lyg o n Mo tor
-2 Be a m 4 LD
-LSU Te mp
S C L_B ELT
S DA_B ELT
AN_C TD1_P
AN_C TD2_P
ADC _C TDLED
FUS ER UNIT
Th e rmistor1 Th e rmistor2
800W la mp
Th e rmo sta t
500W la mp
F US ER B IAS
HVP S
Co ve r
P ANEL_R X
Switc h
D
P ANEL_TX
D
S UB_AC
Motor
OUTBIN SENSOR
S ole noid/Clutc h
-Fus e r Fa n
-Re a r Fa n
P TB UNIT
CRUM
ACR s e n s o r L/R
CTD s e n s or
Ca s s e tte
-MP Pic kup So le noid
-MP Emp ty Se n s o r
S e ns or
-FCF Emp ty
-CST De te c t
-Fe e d Se n s o r
OP
-Exit Se n s o r
P a ne l
-Re g i Se n s or
-P-s ize Se n s o r
-HVPS Fa n
DEVE CRUM IF PBA
DEVE Y CRUM
DEVE M CRUM
DEVE C CRUM
DEVE K CRUM
2-18