1.2
Board to board connector
Process tools
•
BGA replacement equipment
•
Pair of tweezers
•
Solder cleaning wiper (Tin wick)
•
Solder paste
•
Gel flux
Equipment
•
ESD-gloves (cotton gloves)
•
ESD-wristband
Instruction
•
Disassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83
Step-by-Step Instructions
1
Replace the component.
Use BGA repair equipment.
After soldering check for solder bridges between
solder joints.
•
Reassemble the phone as described in Working Instruction 3/00021-1/FEA 209 544/83
3/00021-2/FEA 209 544/83 A
Company Internal
Sony Ericsson Mobile Communications AB
Working Instruction, Electrical
3(9)