Aurora Wireless Networks Inc reserves the right in its sole discretion and without notice to you to change Product specifications and materials and/or revise this document or withdraw it at any time. The Product Developer assumes the full risk of using the Product specifications and any other information provided.
3. Bill of Materials (BOM, AWN, Ultra, Rev 2, Mar 22, 2021.BOM) Product Overview MLink Ultra (AMU900) is the next generation of MLink 900. It is an ultra energy and cost efficient, long range wireless network. Available as a module, development platform or a fully customized product.
MLink Ultra module. Figure 8.1.1.1 below shows the contents that must be included in this label. 2. MLink Ultra modules may only be used with the antenna that has been tested and approved for use with the module.
8.1.2 FCC Notices WARNING: The MLink Ultra modules have been tested by the FCC for use with other products without further certification (as per FCC Section 2.1091). Changes or modifications to this device not expressly approved by Aurora Wireless Networks Inc could void the user’s authority to operate the equipment.
Approved Antennas MLink Ultra modules are approved for mobile and fixed applications. FCC & IC requires that for mobile applications the antenna be mounted a minimum of 20 cm from users, as captured in section 8.1.2 above.
8.3.2 External Antenna Mlink Ultra modules have been approved for use with an external Yagi antenna captured below including a 1.2 dB min cable loss. External antenna types with the same or lower maximum gain are permitted for use with MLink Ultra. Professional installation is required for the external antenna.
32 ft min of LMR-400 (3.9 dB/100 ft @ 900 MHz) Integration Instructions MLink Ultra is designed for use in countless wireless applications requiring long range communications with low energy consumption. To ensure that the final product complies with the all of the regulatory requirements for the Modular Grant the following integration instructions should be followed.
The recommended footprint is shown in the figure below. Figure 9.1.2 – Recommended MLink Ultra Footprint Minimal circuitry is required to support MLink Ultra and therefore the PCB can be a simple 2 layer FR4 board with ground plane (> 1350 mm ) on the bottom opposite layer to the MLink Ultra module for heat dissipation.
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