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Compact Fieldbus Power Hub,Generic Interface
Specification
The following table summarizes the main features and benefits of the Power Hub:
Features
Lowest heat dissipation of less than 2 W per
segment under full load condition.
Exchange of modules while the system is
energized and load share between power
modules.
Full balance of electric circuitry with high
isolation against RF and in-band interference.
High-integrity passive power conditioners.
Local and remote alarm annunciation.
Tolerance against inrush currents during
segment start.
Full current span operation from 10...500 mA. Flexible segment design and tolerance
Advanced Diagnostic Module for physical
layer fieldbus diagnostics.
2.2
System components
2.2.1
Motherboard
MBHC-FB-8R
The motherboard MBHC-FB-8R enables the redundant supply of eight segments and the
connection of the FOUNDATION Fieldbus H1 Host system. 16 sockets hold the power supply
modules, with two each supplying one of the eight segments redundantly. Two extra sockets
hold diagnostic modules.
Note!
If the motherboard is intended to be used with dedicated Power Supply Modules and Segment
Protectors to generate Ex ic rated outputs, a connector cover has to be mounted on each
power supply terminal. Two connector covers and special connectors come with each
motherboard.
2.2.2
Power Supply Modules HCD2-FBPS-*
Power Supply Modules are modules providing full galvanic isolation between the bulk power
supply and the segments. They provide optimum system reliability for applications where
cabling and wiring are routed through critical or harsh electrical environments, i.e., where
superior protection from electromagnetic interference (EMI) is mandatory.
Power modules are connected to the motherboard via sockets. They can be exchanged while
the system is in operation. In redundant configuration, load is shared between two power
modules.
For different application requirements special Power Supply Modules are available:
Designation
HCD2-FBPS-1.500
HCD2-FBPS-1.23.500
User benefit
Long service life. Very high packing density
and reduced cooling requirements.
Increased segment availability.
High resistance to external disturbance such
as EMI.
Long service life.
Easy maintenance and troubleshooting.
Long-term, robust operation with tolerance
towards field device misbehavior.
against live working on field devices.
Improved and known quality of fieldbus
installation. Live supervision for preventive
and pro-active maintenance. Professional
tools for easy fieldbus troubleshooting.
Application
General purpose
Ex ic, Ex nL
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