Work Process - HTC SkyWriter Service Manual

Doc. Title
Underfill re-work process
There are five components with underfill process, BU1,U1,U4, U345,U374 these component are
not suggested to be Re-worked, but if it is requested to do re-work, the following re-work process
must be followed –up.
1. Use the sharp hand of soldering iron to break the bridge of CSP.
2. After the Bridge be broken, Use SMD rework station to remove CSP, the temperature must be
set in 210~240℃,there are a litter underfill remained on the surface of PCB.
HTC confidential
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TOTAL 83
宏達國際電子股份有限公司
HTC Corporation
SkyWriter Service Manual
PAGE NO. 82
Doc. No. DOC-00045404
Issued Date
2008/08/18
Revised Date 2008/08/15
Page
Remained Underfill
REV.
A01
82 of 83
Break Bridge