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DS108 Maintenance Manual For internal use only 2011-8-20 Document Name :DS108 Maintenance Manual Version:V1.0 Draft date:2011-8-20 Document code:...
The machine disassemble chart and parts lists 2.1 DS108 GSM digital telephone decomposition figure Assemble and disassemble guidelines 3.1 Assemble introduction 1. Assemble PCBA. a:Assemble Dome; refer to the four holes in Dome. Reference holes...
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b:Solder LCD; refer to the sign on the main board, then stick the gasket under LCD d: lie the LCM to main board Gasket Mylar tap e. Solder vibrator and speaker, torch, notice to the polar, as figure.
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f. Assemble Speaker trestle as below turn put Speaker into trestle,Assemble holder to PCBA —vibrator—fasten screw . g. Assemble GSM antenna, then fasten the screw.
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h. Solder microphone 2. Assemble cover a:Assemble keypad,Receiver, as figure Here first...
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b: Put PCBA in to cover, notice on the hook and microphone. c: Assemble torch lens d: Assemble B cover ①button B cover ②Fasten Screws ③Fill the plug...
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3.1Disassemble introduction Disassembly process is opposite to assembly process...
Dual SIM 5 Notes on Failure Handling Notes: The PCBA repairing is a very important procedure during the final production of cellular phones. The speed and quality of repairing decides the yield and production efficiency. The repair idea is very important for a good repairing technician. Make sure not to heat a board right away once a phone reaches at hand.
6. Fault repair 6.1Base band MTK uses relatively high integration and has limited peripheral independent elements. Check whether there is any additional element, missing or wrong element before hot air gun is used. If visual detection fails to find problem, use some equipments to find failure positions。...
(3) 30~90MA: if the software, 26M and 32K are all normal, the cause can be incomplete soldering. Check CPU and Flash Startup process: When the Power-On button is pressed, PWRKEY will detect a low voltage. The internal PMIC will turn on the LDOs which provide power-supply to base band 30ms later; then the RESET circuit of the PMIC will generate the reset signal 200ms later to make the base band chip run the power-on software 6.2Fail to download...
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7.1Configuration defect For structural parts of the fault, please refer to phone the disassembly procedures for the corresponding change。 7.2 Unable to power on the phone...
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7.8 Keypad fault Keypad doesn’t work correctly Check : DOME is pasted and Paste the DOME or keymat is assembled correctly assemble keymat again Is there any dirty on keypad Clean keypad surface and surface? test Is sidekey soldered well? Solder or replace sidekey No short circuit Replace new mainboard...
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7.9 Receiver fault No voice in receiver Is receiver ok ? Replace new receiver No broken wire Check receiver connector for Solder receiver connector soldering defect Check receiver circuit for any Mark the mainboard with fault analysis result Replace new mainboard...
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7.12 Bluetooth fault Bluetooth can’t work Software version is correct Re-download software Is BT antenna assembled Re-assemble BT antenna correctly? Check BT circuit Mark the mainboard with No short circuit or open circuit analysis result Replace new mainboard...
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7.13 No RF Signal No RF signal Is RF antenna assembled correctly? Re-assemble BT anntena Is the phone set into Flying Return to Normal mode mode? Mark the mainboard with Check RF circuit for any fault analysis result Replace new mainboard...
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7.14 Failure to read T-flash card Failure to read T-flash card Is T-flash card inserted correctly? Re-insert T-flash card Check: the T-flash card is ok? Replace new card Clean socket or replace Check card socket is clean and socket no physical fault Mark the mainboard with Check card circuit for any fault analysis result...
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