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Item Description
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 Phillips Screw Driver
Description #2 Flat Screw Driver
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Use a P1 Phillips Screw Driver to remove Fan finger screw and remove PSU and PSU blank bracket on chassis. (see 3.1.1)
Use a P1 Phillips Screw Driver to remove cover and chassis screws .(see 3.1.2)
2.
Remove flat cable and fan cable and plastic front bezel. (see 3.1.3)
3.
Use a P1 Phillips Screw Driver to remove wind baffles on Main board .(see 3.1.4)
4.
Use a P1 and P2 Phillips Screw Driver to remove screws of LED board and main board and FAN board.(see 3.1.5)
5.
Use a P1 Phillips Screw Driver to remove MAC heatink and remove VRM modules / bettery on the main board.(see 3.1.6)
6.
Use a flat screw driver to remove thermal pad and USB gasket on the chassis. (see 3.1.7)
7.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
MF877-00
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at
Notes
Tool Size (if
applicable)
P1,P2
any
MF877-01
Quantity
of items
included
in product
0
0
0
Page 2
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