Chengdu Ebyte Electronic Technology Co., Ltd
1.Overview ............................................................................................................................................................ 2
1.1 Brief introduction .................................................................................................................................... 2
1.2 Features ................................................................................................................................................... 2
1.3 Application .............................................................................................................................................. 2
2. Specification and parameter .............................................................................................................................. 3
2.1 Limit parameter ....................................................................................................................................... 3
2.2 Operating parameter ................................................................................................................................ 3
3. Size and pin definition ...................................................................................................................................... 4
4.Basic operation ................................................................................................................................................... 5
Hardware design ................................................................................................................................ 5
4.1
Software editing ................................................................................................................................. 5
4.2
5 Circuit diagram ................................................................................................................................................... 6
6. FAQ .................................................................................................................................................................. 6
6.2 Module is easy to damage ....................................................................................................................... 6
7.Soldering guidance ............................................................................................................................................. 6
7.2 Reflow soldering curve ........................................................................................................................... 7
8 Packing method for bulk order .......................................................................................................................... 7
Revision history .................................................................................................................................................... 8
About us ................................................................................................................................................................ 8
CONTENTS
E01C-ML01S User Manual
1
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