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Item Description
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 Phillips Screw Driver
Description #2 Flat Screw Driver
Description #3 Pliers
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Use a P1 Phillips Screw Driver to remove cover and chassis screws (see 3.1.1)
2. Remove of all cables. (see 3.1.2)
3. Use a P2 Phillips Screw Driver to remove Fan screws and Fans (see 3.1.3)
4. Use a P2 Phillips Screw Driver to remove air baffle screws and air baffle (see 3.1.4)
5. Use a P2 Phillips Screw Driver to remove power supply and main board screws, and use a Pliers to remove NUT(see 3.1.5)
6. Untie NFC cable and use a P2 Phillips Screw Driver to remove LED board screws, and LED board (see 3.1.6)
7. Use a P1 Phillips Screw Driver to remove screws of the front and rear bezel. (see 3.1.7)
8. Use a flat screw driver to remove USB gasket and NFC antenna and AC cable on the chassis. (see 3.1.8)
9. Remove light pipe on the LED board.(see 3.1.9)
10. Remove a battery on the main board.(see 3.1.10)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
MF877-00
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at
Notes
Tool Size (if
applicable)
P1,P2
any
any
MF877-01
Quantity
of items
included
in product
0
Page 2
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