BCM EMS-TGL Quick Reference Manual page 11

Intel 11th gen intel®core processor i7/i5/i3 fanless rugged embedded system
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Package vibration
test
Shock
Package Drop Test
IP
Operating
Temperature
Operating Humidity
Storage
Temperature
Certification
OS Supported
Compliant with following Flexible IET Expansion Modules
AUX-M02
AUX-M04
EBM-CDVS DB-A
EBM-BYTS DB-E
EBM-BYTS DB-A
AUX-M01
AUX-M07
Note:
Specifications are subject to change without notice.
1. PSD: 0.026G²/Hz , 2.16 Grms
2. Non-operation mode
3. Test Frequency : 5-500Hz
4. Test Axis : X,Y and Z axis
5. 30 min. per each axis
6. IEC 60068-2-64 Test:Fh
1. Wave form:Half Sine wave
2. Acceleration Rate:55g for operation mode
3. Duration Time:11ms
4. No. of Shock:+/- XYZ axis 18 times
5. Operation mode
6. Reference IEC 60068-2-27 Testing procedures Test Eb : Shock Test
1. One corner , three edges, six faces
2. ISTA 2A, IEC-60068-2-32 Test:Ed
IP 50
-40°C ~ 70°C (w/SSD) ambient w/ air flow, WT sku
0°C ~ 70°C (w/SSD) ambient w/ air flow, ST sku
40°C @ 95% Relative Humidity, Non-condensing
-40°C ~ 75°C (-40°F ~ 167°F)
CE, FCC Class B
Win 10 64bit / Linux
4 x LAN supports 2-Pair LAN bypass + 2 x USB 2.0
4 x LAN supports PoE 802.3af + 2 x USB 2.0
1 x DVI-D + 2 x USB 2.0
4 x USB 3.0 + 3 x USB 2.0
1 x HDMI, 2 x RJ45, 2 x RS-232/422/485 (BIOS), 2 x USB 2.0
4 x RS-232/422/485(BIOS), 2 x USB 2.0
4 x RS-232/422/485(BIOS) w/ 2.5KV isolation, 2 x USB 2.0
EMS-TGL Series Quick Reference Guide 11
Quick Reference Guide

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