2.2.5.5.
2.2.6.
2.2.6.1.
2.2.6.2.
2.2.6.3.
2.2.6.4.
2.2.7.
Software Descriptions .................................................................................................. 2 − 27
2.2.7.1.
2.2.7.2.
2.2.7.3.
3.
Disassembly and Reassembly .............................................................................................................. 3 − 1
3.1.
3.1.1.
3.1.2.
3.1.3.
Releasing Plastic Latches .............................................................................................. 3 − 2
3.2.
Screws used in the printer.......................................................................................................... 3 − 3
3.3.
3.3.1.
Cover ........................................................................................................................ 3 − 4
3.3.2.
Main board................................................................................................................. 3 − 6
3.3.3.
Fuser Unit .................................................................................................................. 3 − 6
3.3.4.
SMPS/HVPS board...................................................................................................... 3 − 7
3.3.5.
Drive Unit.................................................................................................................. 3 − 7
3.3.6.
LSU.......................................................................................................................... 3 − 8
3.3.7.
Feed Sensor PBA ........................................................................................................ 3 − 9
3.3.8.
Pick up roller .............................................................................................................. 3 − 9
3.3.9.
Motor........................................................................................................................ 3 − 10
3.3.10. Transfer Roller............................................................................................................ 3 − 11
4.
4.1.
Alignment and Adjustments....................................................................................................... 4 − 1
4.1.1.
Control Panel.............................................................................................................. 4 − 1
4.1.2.
4.1.3.
Jam Removal.............................................................................................................. 4 − 4
4.1.4.
Periodic Defective Image .............................................................................................. 4 − 7
4.1.5.
Useful management tools .............................................................................................. 4 − 8
4.1.5.1.
4.1.5.2.
4.1.5.3.
4.1.6.
Updating Firmware ...................................................................................................... 4 − 13
4.1.6.1.
4.1.6.2.
Copyright© 1995-2013 SAMSUNG. All rights reserved.
Feeding ....................................................................................................... 2 − 25
Transfer....................................................................................................... 2 − 25
Fusing......................................................................................................... 2 − 26
LSU............................................................................................................ 2 − 26
Architecture ................................................................................................. 2 − 27
Data and Control Flow ................................................................................... 2 − 28
Contents
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