Sony Ericsson V800 Working Instruction, Electrical

Sony Ericsson V800 Working Instruction, Electrical

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Working Instruction, Electrical
Applicable for V800/ 802se
INDEX
1
LEAD FREE SOLDERING..........................................................................................................................................2
1.1
.........................................................................................................................................................2
1.1.1
Environment.....................................................................................................................................................2
1.1.2
Soldering temperature .....................................................................................................................................3
2
BGA EQUIPMENT REFLOW PROFILES ...............................................................................................................5
2.1
2.1.1
Reflow Profiles ................................................................................................................................................6
3
REPLACEMENT OF PARTS......................................................................................................................................7
3.1
..............................................................................................................................................................7
3.2
3.2.1
External Antenna Connector ...........................................................................................................................8
3.2.2
30 PIN BTB Female Connector, behind the System Connector.......................................................................8
3.2.3
30 PIN BTB Female Connector .......................................................................................................................9
3.2.4
50 PIN BTB Female Connector .......................................................................................................................9
3.2.5
Battery Connector..........................................................................................................................................10
3.2.6
USB Connector ..............................................................................................................................................10
3.2.7
MS Duo and SIM Reader ...............................................................................................................................11
3.2.8
Hall Element ..................................................................................................................................................11
3.2.9
IrDa Module ..................................................................................................................................................12
3.2.10
Coax Connector .............................................................................................................................................12
4
REVISION HISTORY ................................................................................................................................................13
3/000 21-2/FEA 209544/88 C
Company Internal
Sony Ericsson Mobile Communications AB
................................................................................................................................5
......................................................................................................................7
Working Instruction, Electrical
Approved according to 000 21-LXE 107 42/1

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Summary of Contents for Sony Ericsson V800

  • Page 1: Table Of Contents

    Working Instruction, Electrical Working Instruction, Electrical Applicable for V800/ 802se INDEX LEAD FREE SOLDERING............................2 .................................2 NTRODUCTION 1.1.1 Environment..............................2 1.1.2 Soldering temperature .............................3 BGA EQUIPMENT REFLOW PROFILES .......................5 ..........................5 EMPERATURE MEASUREMENT 2.1.1 Reflow Profiles ..............................6 REPLACEMENT OF PARTS............................7 ................................7 QUIPMENT ........................7 NSTRUCTION HOW REPLACING PARTS 3.2.1...
  • Page 2: Lead Free Soldering

    The introduction of the environment is as follow: Information text This symbol indicates that the product is lead free. All lead free PCB will be marked with this symbol, according to the arrow. 3/000 21-2/FEA 209544/88 C 2(13)  Company Internal Sony Ericsson Mobile Communications AB...
  • Page 3: Soldering Temperature

    Lead Free Solder does not flow as well as leaded solder. Some of the solder pad area may remain exposed. The picture shows an example of Lead Free Solders joints. 3/000 21-2/FEA 209544/88 C 3(13)  Company Internal Sony Ericsson Mobile Communications AB...
  • Page 4 The picture shows an example of solder joints with lead. The picture shows an example of lead free solder joints. The picture shows an example of solder joints with lead. 3/000 21-2/FEA 209544/88 C 4(13)  Company Internal Sony Ericsson Mobile Communications AB...
  • Page 5: Bga Equipment Reflow Profiles

    NOTE: These values are recommendations and may have to be changed depending on the type of equipment. The maximum temperature for any component must not exceed 250C. 3/000 21-2/FEA 209544/88 C 5(13)  Company Internal Sony Ericsson Mobile Communications AB...
  • Page 6: Reflow Profiles

    Minimum temperature 235°C Maximum temperature 245°C or 260°C* for 10 sec Total time Appr. 4-7 min * The higher temperature in case the board has extremely high ∆T. 3/000 21-2/FEA 209544/88 C 6(13)  Company Internal Sony Ericsson Mobile Communications AB...
  • Page 7: Replacement Of Parts

    Working Instruction 3/00021-2/FEA 209 544/88 PA1 After the part is replaced it is important to assemble the phone according to the Working Instruction 3/00021-2/FEA 209 544/88 PA1. 3/000 21-2/FEA 209544/88 C 7(13)  Company Internal Sony Ericsson Mobile Communications AB...
  • Page 8: External Antenna Connector

    Use BGA Repair Equipment to replace the Antenna 30 PIN BTB Female Connector to the right position, according to the arrow (3). Apply a new Sealing Gasket. 3/000 21-2/FEA 209544/88 C 8(13)  Company Internal Sony Ericsson Mobile Communications AB...
  • Page 9: Pin Btb Female Connector

    Use the BGA Repair Equipment to replace the antenna 30 PIN BTB Female Connector to the right position, according to the arrow (2). Apply a new Sealing Gasket. 3/000 21-2/FEA 209544/88 C 9(13)  Company Internal Sony Ericsson Mobile Communications AB...
  • Page 10: Battery Connector

    This is the instruction how to replace the USB Connector: Step-by-Step Instructions NOTE! The USB Connector is located according to the arrow. Use a soldering iron to replace USB Connector. 3/000 21-2/FEA 209544/88 C 10(13)  Company Internal Sony Ericsson Mobile Communications AB...
  • Page 11: Ms Duo And Sim Reader

    This is the instruction how to replace the Hall element: Step-by-Step Instructions NOTE! The Hall Element is located according to the arrow. Use a soldering iron to replace the Hall Element. 3/000 21-2/FEA 209544/88 C 11(13)  Company Internal Sony Ericsson Mobile Communications AB...
  • Page 12: Irda Module

    This is the instruction how to replace the Coax Connector: NOTE! The Coax Connector is located according to the arrow. Use a soldering iron to replace the Coax Connector. 3/000 21-2/FEA 209544/88 C 12(13)  Company Internal Sony Ericsson Mobile Communications AB...
  • Page 13: Revision History

    The list over the revision history is as follows: Rev. Date Changes / Comments 2004-11-17 First Release 2004-12-13 Due to system problem 2004-12-15 Due to system problem 3/000 21-2/FEA 209544/88 C 13(13)  Company Internal Sony Ericsson Mobile Communications AB...

This manual is also suitable for:

802seV800i

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