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Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP FF 12916E Switch Chassis(JH103A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic
instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as
defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame
Retardantsweighing> 25 grams (not including
PCBs or PCAs already listed as a separate item
above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sqcm
All types including standard alkaline and lithium
coin or button style batteries
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Quantity
of items
included
in product
3
0
0
0
0
0
0
0
0
0
0
0
0
0
Page 1
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Summary of Contents for HP FF 12916E
- Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
- Page 2 radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable) Screw driver 3.0 Product Disassembly Process...
- Page 3 3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations). Figure 1Overall view of the product Figure 2Treatments to the product EL-MF877-00 Page 3 Template Revision B...
- Page 4 Figure 3Treatments to the part 3Figure 4 Treatments to the part 4 Figure5Treatments to the part 5 Figure 6Treatments to the part 6 EL-MF877-00 Page 4 Template Revision B...
- Page 5 Figure 7Treatments to the part 7 Figure8Treatments to the part 7-3 Figure9Treatments to the part 8 EL-MF877-00 Page 5 Template Revision B...
- Page 6 Figure10Treatments to the part 8-5 3.3 Material of the facility built Facility Components Material Weight(g) Weight Selective treatment for Details percentage materials andcomponents 0.04% Pla recycling 2230 2.76% Fe recycling 0.01% Cu recycling 10.4 0.01% Pla recycling Fe,Al 430.4 0.53% Fe,Al recycling 0.06% Cu recycling...
- Page 7 4. Revised record Date Version Author Modify content 2015.05.11 Xue Gang Initial version EL-MF877-00 Page 7 Template Revision B...