CONTENTS ONTENTS 1. Warnings and Safety Precautions ..............1 1.1. Guidelines on Safety at Work .................1 1.2. Definition of Danger Advice and Warnings .............1 1.3. Intended Use of this Machine .................1 1.4. Main Switch with Emergency Off Function .............1 1.5. Dangers ......................2 1.5.1.
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CONTENTS 3.2.8. Basic Pneumatic Settings ..............21 3.3. Operating Sequences ...................22 3.3.1. Switching the Machine On/Off .............22 3.3.2. Switching On and Calibrating the Exposure Lamp ......23 3.3.3. Setting Exposure Values ..............24 3.3.4. Saving and Loading Programs ............25 3.3.5. Loading the Mask ................26 3.3.6.
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CONTENTS 4.6. Schematics of the Pneumatic System MJB4 ..........53 4.7. Schematics of the Electronic System MJB4 ..........63 4.8. International Chemical Safety Cards Mercury ..........149 4.9. Lock-Out / Tag-Out Checklist ..............152 MJB4 - Contents Rev02 01-06...
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IR adjustment is available for both microscopes. These microscopes were developed from the successful SUSS MJB3 Mask Aligners, which were the international leaders among these types of instruments for over 3 decades.
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Attention ! It is strongly recommended to read this user manual before starting the mask aligner the first time. MJB4 - Attention ! Rev02 01-06...
SUSS MicroTec cannot accept any responsibility for physical injury or damage to the machine which re- sults from incorrect use of this machine and failure Any other form of use must be agreed on with SUSS to follow these safety instructions. MicroTec Lithography's Engineering Product Sup- port department.
WARNINGS AND SAFETY PRECAUTIONS To begin operating the machine again, the main The lamp cooling must be correctly adjusted accord- switch must be turned to ON and the machine must ing to the lamp type! be restarted. There is a risk of lamp explosion if the lamp house is opened prematurely while the lamp is hot.
Mercury can cause acute and chronic poisoning. Only SUSS MicroTec employees or qualified and Note: trained staff may service the machine. The EU safety data sheets can be found The operating and starting voltages in in the Appendix and must be read.
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1.6.1.2. Changing the Lamp served. Only use lamps of a type approved for use by SUSS MicroTec Lithography! Significant deviations from the setting values endan- ger your safety! In almost all exposure lamps, the anode (positive pole) is at the bottom.
WARNINGS AND SAFETY PRECAUTIONS MicroTec's service to carry out a check! chine has been connected to the power supply net- work by switching on the main power switch. Note! The following pressure values should be present on In addition, in order to achieve good ex- the machine: posure results, the evenness of the light should be adjusted after fitting a...
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WARNINGS AND SAFETY PRECAUTIONS MJB4 - Warnings and Safety Rev02 01-06...
Users who open containers with system compo- nents or install or transport the machine without a SUSS MicroTec technician or a person authorized by SUSS MicroTec do so at their own risk. Power connections and supply connections (com- pressed air, nitrogen, etc.) at the installation site must be completely installed by the customer before installation so the machine can be connected.
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INSTALLATION AND TRANSPORT Power Data: Supply Media: Standard with 300 VA ; 230 V AC ±10% ; Nitrogen: ca. 1.5bar, 30 - 45 psi; CPC200: 50/60 Hz Consumption: Depends on lamp model; see Standard with 500 VA ; 230 V AC ±10% ; the table ”Settings for lamp CPC350: 50/60 Hz...
Users who transport the machine without a SUSS tainers MicroTec service technician or a person authorized by SUSS MicroTec do so at their own risk. • If shipping damage is suspected, do not open containers until a SUSS MicroTec service 2.2.1.
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INSTALLATION AND TRANSPORT transporting the it on wheels over a ramp. • We recommend using cross beam part no.: 187724 for transporting the machine (see figure: Warning! “Transporting the MJB4 using a cross beam”). The center of gravity is behind the mid- The cross beam ensures that the transport straps dle of the machine (lamp housing).
INSTALLATION AND TRANSPORT 2.2.5. Transport Safeguards TSA Microscope Manipulator The following transportation safeguards must be Remove screws 1 and 2. removed before commissioning the machine. Screw 1 secures the microscope stroke, and screw Adjusting Table 2 secures the X-Y adjustment on the manipulator. Transportation safety screws 1 (3x) and 2 (2x) must be removed from the adjusting table.
Before shutting down the machine for a longer mirror housing. period of time, you must be advised by a SUSS MicroTec service technician. We strongly recommend the following before long- term decommissioning: •...
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INSTALLATION AND TRANSPORT MJB4 - Installation and Transport Rev02 01-06...
Masks and wafer/substrates to a total thickness of pneumatic system and the PLC controller, can be 9.00 mm can be processed. quickly replaced. SUSS MJB4 Mask Aligner 1 TSA/IR lighting 6 Main switch with emergency off function 2 Microscope focus setting...
MJB4 OPERATION OF THE 3.1. Definitions 3.2. Controls and Displays Main switch with emergency off function 3.1.1. Notations This switch connects or disconnects the mask You should be familiar with the following definitions aligner and ballasts to or from the power supply when reading this manual.
MJB4 OPERATION OF THE 3.2.2. Display/Touch Screen Table – Theta Motion This is the small micrometer screw on the right side Instructions, confirmations and other information of the adjusting table. The maximum turning range is appear on this screen depending on the situation. ±5°.
MJB4 OPERATION OF THE 3.2.3. TSA Microscope 3.2.4. TSA Microscope Manipulator 3.2.4.1. M500 Microscope The microscope manipulator is moved in the X and Y directions using the split knurled knob on the right Brightness is regulated with the left controller under side of the manipulator.
MJB4 OPERATION OF THE Lens X Separation Button The left/right lens can be moved separately in the X direction using the left/right controller. TSA Lighting Aperture Diaphragm The left and right aperture diaphragms are used for the separate setting of the left and right lens lighting. TSA Splitfield Switch This switch on the front of the microscope selects the left and/or right lens images as the source for the...
Exposure intensity and 1.2.7. "Buttons in the Display / Touch Screen"). homogeneity can now be measured. To end the Using the SUSS UV1000 intensity meter with the sequence, move the contact level forward. The appropriate probe, you check and set the intensity aligner returns to its initial status.
MJB4 OPERATION OF THE 3.2.8. Basic Pneumatic Settings corresponding manometer. All main pressures are monitored by detectors which display an error message in the display if there is a deviation of approx. -20%. Low Vacuum (with controller) This controller sets the low pressure in the vacuum chamber between the substrate and mask.
MJB4 OPERATION OF THE 3.3. Operating Sequences the lamp, proceed as described in section 1.3.2. "Switching On and Calibrating the Exposure Lamp". A brief introduction can be found in section 1.8. "Step-by-step Machine Operation". 3.3.1.3. Switching Off the Machine 3.3.1. Switching the Machine On/ The machine is switched off using the Electronics ON/OFF button.
Afterwards the exposure lamp must be switched on with the LAMP OFF button. The label of the button SUSS MicroTec assumes no liability for damages changes to LAMP HEATING during the warm up resulting from the improper use of the mask aligner.
MJB4 OPERATION OF THE 3.3.3. Setting Exposure Values Hard Contact Time This selection is activated by pressing the This function is used to set the time for nitrogen SETTINGS MENU button and the EXPOSURE flushing under the substrate before exposure. VALUES button.
MJB4 OPERATION OF THE 3.3.4. Saving and Loading Pro- grams This function is an optimal method for saving selected settings to a specific program space (0 to 96) or selecting a previously saved program. Select the PROGRAM MENU in the SETTINGS MENU.
MJB4 OPERATION OF THE 3.3.5. Loading the Mask 3.3.6. Loading the Substrate Caution! Pulling out the transport slide and loading the substrate If the microscope is in the lower posi- tion when loading or unloading the Pull out the transport slide as far as it will go. Insert mask, the microscope must be moved to the upper position by pressing the a suitable substrate retainer (chuck) with the...
MJB4 OPERATION OF THE 3.3.9. Wedge Error Compensation (WEC) The WEC is performed manually. To perform WEC using the contact lever, the separation lever must be in the contact position. The substrate is moved against the mask with the previously set pressure (see 3.3.6) and WEC is performed.
MJB4 OPERATION OF THE 3.4. First Exposure of Sub- The exposure unit moves by approx. strate 150 mm in the direction of the operator. Unloading the Mask No adjustment is necessary for the first exposure of the substrate. With the machine in its initial state, the following procedure steps are required: To release the mask holder, remove both screws on the right side of the mask holder frame.
MJB4 OPERATION OF THE 3.5. Adjusting the Substrate Experienced operators can use the contact lever with the Upper Micro- without first selecting the LOAD SUBSTRATE scope button. 3.5.4. Adjusting the Microscope In this mode the substrate is adjusted using the TSA microscope.
MJB4 OPERATION OF THE 3.6. Adjusting the Substrate Never adjust the substrate if the mask with IR Lighting and substrate are in contact! Doing so will damage the mask and substrate. Checking the adjustment see section 1.2.7. "Buttons For IR substrate adjustment, special IR cameras p/n in the Display / Touch Screen".
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MJB4 OPERATION OF THE Setting the separation lever to the adjusting po- Adjustment (menu in the SUBSTRATE ADJUST- sition MENT display) Never adjust the substrate if the mask Use the X, Y and theta micrometer screws on the and substrate are in contact! Doing so adjusting table for this.
MJB4 OPERATION OF THE 3.6.2. Transmitted Light Set the brightness using the left/right potentiometers on the left front plate. 3.6.2.1. Setting the Exposure Values The left and right aperture diaphragms on the See section 1.3.3. "Setting Exposure Values". microscope allow you to set the lighting on the left and right separately.
MJB4 OPERATION OF THE 3.7. Advanced Techniques 3.6.2.5. Adjusting the Substrate Focusing the Substrate Level 3.7.1. Exposure Programs For fine lens adjustment, use the OBJECTIVE FOCUS FINE MANUAL knob on the microscope. An important parameter for exposure is the type of Adjustment (menu in the SUBSTRATE ADJUST- contact between the mask and substrate.
MJB4 OPERATION OF THE Exposure Time gradually reduce these times. All parameters can be set in the EXPOSURE Pressing this button opens the EXPOSURE VALUES menu. To test the set values and the TIME menu, which allows you to enter the de- adjustment, use the CHECK ADJUSTMENT button.
MJB4 OPERATION OF THE 3.8. Step-by-step Machine Operation 3.8.1. Selecting exposure program, e.g., soft contact Menu in the Display Button Strokes in the Display MAIN MENU SETTINGS MENU SETTINGS MENU EXPOSURE VALUES ADJUSTING & EXPOSING LAMP TEST PROCESS selection FIRST EXPOSURE FLOOD EXPOSURE SOFT CONTACT HARD CONTACT...
MJB4 OPERATION OF THE 3.8.2. Programs Saving a New Program All active parameters are stored under a selected program number. Menu in the Display Button Strokes in the Display MAIN MENU SETTINGS MENU SETTINGS MENU PROGRAM MENU CONTENT Select available program space PROGRAM MENU SAVE All parameters stored under the program number...
MJB4 OPERATION OF THE 3.8.3. Loading, Adjusting and Exposing the Substrate Menu in the Display Button Strokes in the Display MAIN MENU LOAD SUBSTRATE LOAD SUBSTRATE Load the mask holder with the mask Pull out the slide and load the chuck Place the substrate on the chuck Insert the slide completely Raise the substrate with the contact lever (WEC)
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MJB4 OPERATION OF THE MJB4 - Operation Rev02 01-06...
MJB4 PPENDIX 4. A PPENDIX 4.1. Parameter Ranges and This table lists the value ranges of parameters used Default Settings in the main processes. Parameter Description Default value Range of values Expose Type Type of exposure Soft [Soft, Hard, Low Vac, Vac, Flood-E, Lamptest] Exp.
MJB4 PPENDIX 4.5. Service Information Component name Component no. Pneumatic system Adjusting table TSA microscope Exposure unit The first digit in the identifiers of valves, chokes, sen- sors, etc. always refers to the component numbers listed above. Appendix MJB4 E Rev02 01-06...
MJB4 PPENDIX 4.5.1. Overview 4.5.1.1. Valves (Y) Valve Block I Identifier Medium Function Mirror house forward / backward Exposure shutter closer Exposure shutter opener Lamp house heat sink cooling TSA microscope up / down TSA manipulator brakes X and Y direction Unassigned 1.1Y6 Hard contact nitrogen / pressure controlled...
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MJB4 PPENDIX 4.5.1.4. Pressure Regulators (CP) Identifier Function 0CP1 Machine main air pressure 0CP2 Machine main nitrogen pressure 1.3CP1 WEC pressure 4.5.1.5. Flowmeter (F) Identifier Function Lamp socket cooling 4.5.1.6. Gauges (PD) Identifier Function Machine main air pressure Machine main nitrogen pressure Vacuum 4.5.1.7.
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MJB4 PPENDIX 4.5.1.8. Connector on Distribution Board (JP, X) Identifier Function Service PLC Jumper K1 nc / no select PLC base unit (OD232 module) Valve block I Valve block II Power PLC Board connector PLC analog output (AD081) PLC module digital in (ID211) Interlock nitrogen CIC1200 Buzzer Splitter box for camera selection left / right...
MJB4 PPENDIX 4.6. Schematics of the Pneu- matic System MJB4 Item Description Schematic Sheet-No. Page Pneumatic plan 191930 1 of 4 191930 2 of 4 191930 3 of 4 191930 4 of 4 MJB4 - Appendix Rev02 01-06...
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MJB4 PPENDIX Appendix MJB4 E Rev02 01-06...
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