Summary of Contents for PMFoundations Buffered Multipl
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Buffered Multiple V1.0 – Assembly Guide Thank you for purchasing this module! This is an easy build but with some surface mount parts including precision integrated circuits. Some of the pads are quite small and you will need a chisel tip or screwdriver tip soldering iron, fine solder and the skill to solder these tiny joints.
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1. Board preparation Apply flux to the SMD pads. Tin one pad of each SMD footprint with a SMALL amount of solder. For the ICs, apply a tiny amount of solder to two opposite corner pins. 2. 1206 Size Resistors and ceramic capacitors Install the 1206 resistors and 1206 capacitors on the TOP of the board by positioning on the footprint and heating the cap and tinned pad until the part is attached.
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Install the ICs with the correct orientation. Align the dot/line or other marker with the corresponding mark on the board. If you solder the ICs the wrong way round, they will explode and render the board useless when power is connected. Position on the footprint and heat the pin and tinned pad in one corner until the part is attached.
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and/or the lead marked with a + needs to be inserted into the hole that has the “+” marking near it. Leads marked with “-“ go in the board hole WITHOUT the “+”. Solder and clip the leads. 6. 3.5mm Jack Sockets Tack one pin only with solder.
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photo. 2. Put nuts on the jacks and FULLY TIGTEN all of them. Do not overtighten! 3. Now fully solder all the remaining pins on the jacks. 4. If you cut off the ends of the pins of the jacks, near to the solder joint, the module will be easier to fit into your rack close to other modules.
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