Chengdu Ebyte Electronic Technology Co.,Ltd.
6. Welding operation guidance
6.1 Reflow Soldering Temperature
Profile Feature
Solder Paste
Preheat Temperature min (Tsmin)
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time(tL)Maintained Above(TL)
Peak temperature(Tp)
Aveage ramp-down rate(Tp to Tsmax)
Time 25℃ to peak temperature
6.2 Reflow Soldering Curve
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Curve feature
solder paste
Minimum preheating temperature
Maximum preheating temperature
Preheating time
Average rising rate
Liquid phase temperature
Time above liquidus
Peak temperature
Average descent rate
Time of 25 ° C to peak temperature
E76-433M20S User Manual
Sn-Pb Assembly
Pb-Free Assembly
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
6 minutes max
8 minutes max
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6℃/second max
7
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