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Functional Specifications
Features and
Functions
Basic function
Reliability and
availability
Restrictions and
Remarks
Technical Specifications
Table 7-297 Interface specifications
Attribute
Optical type supported
Working mode
Compliant standard
Frame format
Table 7-298 Board specifications
Item
Dimensions (H x W x D)
Typical power
consumption
Typical heat dissipation
Weight
Ambient temperature
Issue ()
Remarks
Supports a maximum of 20 100M/1000M interfaces. Services on each
interface can be configured.
Support for hot swap
Not applicable to outdoor scenarios, a chassis supports a maximum of
five subcards of this type.
Description
8.2 155Mbps SFP Electrical Transceiver
8.3 155Mbps eSFP Optical Module
8.4 155Mbps eSFP BIDI Optical Module
8.6 1Gbps Electrical Transceiver
8.9 1.25Gbps eSFP Optical Module
8.11 1.25Gbps eSFP CWDM Optical Module
8.10 1.25Gbps eSFP BIDI Optical Module
8.12 125M~2.67Gbps eSFP DWDM Optical Module
Full-duplex
IEEE 802.3
Ethernet_II, Ethernet_SAP, and Ethernet_SNAP
Specification
39.6mm x 193.8mm x 209.3 mm (1.56 in. x 7.63 in. x 8.24
in.)
49.0 W
159.0 BTU/hour
1.0 kg (2.2 lb)
Long terms: 0 ° C to 45 ° C (32° F to 113° F) Short terms:
-5 ° C to 55 ° C (23° F to 131° F)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
7 Boards
253
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