HP ProDesk 400 G7 SFF Product End-Of-Life Disassembly Instructions page 2

Item Description
Components and parts containing toner and ink, including
liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing refractory ceramic
fibers
Components, parts and materials containing radioactive
substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring
selective treatment can be removed.
Tool Description
Star screwdriver
Cross screwdrive
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment including the required steps
to remove the external enclosure:
1. Remove Top cover
2. Remove ODD & cable
3. 3.Remove frove bezel
4. Open cage & remove cable form MB
5. Remove storage (3.5"HDD or 2.5"HDD) cad cable
6. 6.Remove Card reader module
7. Remove WLAN module
8. Remove speaker
9. 9.Remove DIMM
10. Remove add-on card
11. Remove hood sensor and fan duct
12. Remove Cooler & CPU
13. Remove antenna
14. Remove flex I/O board
15. Remove MB & PSU
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that
require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision C
Last revalidation date 04-01-2018
Notes
Include the cartridges, print heads, tubes, vent chambers, and
service stations.
HPI instructions for this template are available at EL-MF877-01
Quantity of
items
included in
product
0
0
0
0
Tool Size (if
applicable)
T15 slot
Phillip #1
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