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HP Veer Product End-Of-Life Disassembly Instructions page 2

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Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Cross screw Driver
Plastic tweezers
Anti-magnetic metal tweezers
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Take off front housing cover and uninstall LCM from the hinge.
2.
Remove battery cover and battery.
3.
Disassemble battery strap.
4.
Disassemble speaker box from PCBA.
5.
Remove antenna and microphone boot.
6.
Remove screws X2.
7.
Separate SIM door cover and PCBA from phone chasse.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
0
0
0
Tool Size (if
applicable)
PH 0X50
Page 2

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